Groups > comp.programming.threads > #5020

Intel demos first Lakefield chip design using its 3D stacking architecture

Path	csiph.com!eternal-september.org!feeder.eternal-september.org!reader01.eternal-september.org!.POSTED!not-for-mail
From	Horizon68 <horizon@horizon.com>
Newsgroups	comp.programming.threads
Subject	Intel demos first Lakefield chip design using its 3D stacking architecture
Date	Mon, 6 May 2019 12:17:49 -0700
Organization	A noiseless patient Spider
Lines	21
Message-ID	<qaq18t$brt$5@dont-email.me> (permalink)
Mime-Version	1.0
Content-Type	text/plain; charset=utf-8; format=flowed
Content-Transfer-Encoding	7bit
Injection-Date	Mon, 6 May 2019 19:17:50 -0000 (UTC)
Injection-Info	reader02.eternal-september.org; posting-host="f9281c9ebcb10b028778dde4d6e607ac"; logging-data="12157"; mail-complaints-to="abuse@eternal-september.org"; posting-account="U2FsdGVkX1+vTa9FzXBpNgtqM3RhPv35uzcQLtV9SOk="
User-Agent	Mozilla/5.0 (Windows NT 10.0; WOW64; rv:60.0) Gecko/20100101 Thunderbird/60.6.1
Cancel-Lock	sha1:5mcieZgyx5pHpFhUzQ48qRa4nME=
Content-Language	en-US
X-Mozilla-News-Host	news://news.eternal-september.org:119
Xref	csiph.com comp.programming.threads:5020

Show key headers only | View raw

Hello..


Intel demos first Lakefield chip design using its 3D stacking architecture

The Foveros era at Intel is approaching

Lakefield will specialize in lower-power devices with unique hardware 
constraints, including foldable phones and tablets, drones, smart home 
devices, and other gadgets that require a tiny, all-in-one chip.


Read more here:

https://www.theverge.com/2019/1/7/18173001/intel-lakefield-foveros-3d-chip-stacking-soc-design-ces-2019


Thank you,
Amine Moulay Ramdane.

Back to comp.programming.threads | Previous | Next | Find similar | Unroll thread

Thread

Intel demos first Lakefield chip design using its 3D stacking architecture Horizon68 <horizon@horizon.com> - 2019-05-06 12:17 -0700

csiph-web