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| From | Horizon68 <horizon@horizon.com> |
|---|---|
| Newsgroups | comp.programming.threads |
| Subject | Intel demos first Lakefield chip design using its 3D stacking architecture |
| Date | 2019-05-06 12:17 -0700 |
| Organization | A noiseless patient Spider |
| Message-ID | <qaq18t$brt$5@dont-email.me> (permalink) |
Hello.. Intel demos first Lakefield chip design using its 3D stacking architecture The Foveros era at Intel is approaching Lakefield will specialize in lower-power devices with unique hardware constraints, including foldable phones and tablets, drones, smart home devices, and other gadgets that require a tiny, all-in-one chip. Read more here: https://www.theverge.com/2019/1/7/18173001/intel-lakefield-foveros-3d-chip-stacking-soc-design-ces-2019 Thank you, Amine Moulay Ramdane.
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Intel demos first Lakefield chip design using its 3D stacking architecture Horizon68 <horizon@horizon.com> - 2019-05-06 12:17 -0700
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