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Intel demos first Lakefield chip design using its 3D stacking architecture

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  Intel demos first Lakefield chip design using its 3D stacking architecture Horizon68 <horizon@horizon.com> - 2019-05-06 12:17 -0700

#5020 — Intel demos first Lakefield chip design using its 3D stacking architecture

Hello..


Intel demos first Lakefield chip design using its 3D stacking architecture

The Foveros era at Intel is approaching

Lakefield will specialize in lower-power devices with unique hardware 
constraints, including foldable phones and tablets, drones, smart home 
devices, and other gadgets that require a tiny, all-in-one chip.


Read more here:

https://www.theverge.com/2019/1/7/18173001/intel-lakefield-foveros-3d-chip-stacking-soc-design-ces-2019


Thank you,
Amine Moulay Ramdane.

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