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Re: [PATCH v3 1/2] thermal: mediatek: Add cpu power cooling model.

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On Tue, Nov 10, 2015 at 11:20:18AM +0000, Javi Merino wrote:
> On Fri, Nov 06, 2015 at 08:54:33AM +0530, Viresh Kumar wrote:
> > Cc'ing Javi (which you should have as he wrote the power-thing for
> > cpu-cooling).
> > 
> > On 05-11-15, 19:10, dawei chien wrote:
> > > This is because our platform currently only support mt8173_cpufreq.c, so
> > > that I only add static power model for our owner IC.
> > 
> > Bindings are (normally) supposed to be general than a platform
> > specific.
> > 
> > > Please understanding that I wouldn't give a DT binding document since I
> > > will remove static power table on next version, but I can try to explain
> > > it.
> > 
> > Then just don't add things in the first place.
> > 
> > > As far as I know, static power is somewhat leakage of CPU clusters, so
> > > that we hardly to find a formula, which can suitable all kinds of CPUs
> > > since leakage is different. In ARM IPA framework, static power only need
> > > to be defined by who register cpufreq_power_cooling_register. The
> > > voltage/power table is just one way to present leakage power of CPUs.
> > 
> > The bindings don't fix the values for static power, but just provides
> > a field for platforms to use. Everyone can then send its own power
> > figures. Why do you thing it can't be generalized?
> 
> The way they are described here is useful only for this platform, but
> it's not generic.  It only takes into account voltage as (I assume)
> it's the only variable that affects it in this implementation.  A
> generalized version of the static power should take into account the
> temperature and the idle state.

Still, why would we have one binding to describe static power per platform?

I would prefer we go towards a generalized binding description.

If temperature is not needed on all platforms, make it an optional
property.

BR,

Eduardo Valentin
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Re: [PATCH v3 1/2] thermal: mediatek: Add cpu power cooling model. Eduardo Valentin <edubezval@gmail.com> - 2015-11-04 20:50 +0100
  Re: [PATCH v3 1/2] thermal: mediatek: Add cpu power cooling model. dawei chien <dawei.chien@mediatek.com> - 2015-11-05 12:20 +0100
    Re: [PATCH v3 1/2] thermal: mediatek: Add cpu power cooling model. Viresh Kumar <viresh.kumar@linaro.org> - 2015-11-06 04:30 +0100
      Re: [PATCH v3 1/2] thermal: mediatek: Add cpu power cooling model. Javi Merino <javi.merino@arm.com> - 2015-11-10 12:30 +0100
        Re: [PATCH v3 1/2] thermal: mediatek: Add cpu power cooling model. Eduardo Valentin <edubezval@gmail.com> - 2015-11-10 19:50 +0100
          Re: [PATCH v3 1/2] thermal: mediatek: Add cpu power cooling model. Javi Merino <javi.merino@arm.com> - 2015-11-11 10:40 +0100
        Re: [PATCH v3 1/2] thermal: mediatek: Add cpu power cooling model. Viresh Kumar <viresh.kumar@linaro.org> - 2015-11-13 06:10 +0100

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