Groups | Search | Server Info | Keyboard shortcuts | Login | Register [http] [https] [nntp] [nntps]

Groups > sci.physics > #896379

3D RAM the new normal for SSDs [Mac Neo Case Study] (Re: Economy of Maturation: Mobile HBM Coming!)

Cross-posted to 3 groups.

Show all headers | View raw

Hi,

3D RAM is already the new normal for SSDs.
Nearly all mainstream modern SSDs use 3D NAND
(or V-NAND), where billions of memory cells
are stacked vertically in skyscrapers
rather than being laid out flat.

The Story Behind V-NAND Memory Solution
https://news.samsung.com/us/story-behind-samsungs-pioneering-v-nand-memory-solution

Unlike a traditional desktop or some
Windows laptops where you can slide an
NVMe M.2 drive into a slot, the MacBook
Neo has its 3D NAND chips permanently
soldered directly onto the laptop's motherboard.
There is no card or physical drive to pull out.

Instead of using a third-party SSD controller
chip (like Phison or Silicon Motion), the
storage logic is integrated directly into
the Apple A18 Pro processor. The processor
communicates with the soldered NAND storage
via a custom internal NVMe protocol over
a PCIe connection.

amsung's roadmap is truly ambitious, with
plans to launch the 11th generation of
NAND in 2027 with an estimated 50%
improvement in I/O rates, followed by
1,000-layer NAND chips by 2030. Its
competitor, SK hynix, is also working on
400-layer NAND aiming to have the technology
ready for mass production by the end of 2025,
as we previously mentioned in August.

https://www.techpowerup.com/328244/samsung-plans-400-layer-v-nand-for-2026-and-dram-technology-advancements-by-2027

Bye

Mild Shock schrieb:
> Hi,
> 
> "Mobile HBM" refers to a new, under-development
> form of High Bandwidth Memory (HBM) optimized
> specifically for energy-efficient mobile devices
> like smartphones. Manufacturers such as Samsung
> and SK Hynix are developing this technology to
> make the massive data bandwidth required for complex,
> on-device AI applications available within the strict
> power and space constraints of mobile phones.
> 
> Unlike classic HBM solutions, which rely on
> extra-wide silicon interposers for massive data
> throughput in data centers and graphics cards,
> Mobile HBM utilizes stacked LPDDR architectures.
> The goal is to drastically reduce power consumption
> and heat generation so that large AI models can
> run directly on the device (on-device) without
> placing too heavy a load on the battery. The
> technology is expected to hit the market starting
> in 2026/2027, with Apple among those showing great
> interest in integrating it into future iPhone generations."
> 
> https://www.remio.ai/post/mobile-hbm-the-ai-memory-tech-that-could-reshape-the-iphone 
> 
> 
> Just think of a Mac Neo, which has now 8 GB,
> but the memory going 3D in 12 layers, thats a
> massive of 96 GB very fast memory.
> 
> Economy of scale comes later, when the same CPU/
> GPU/RAM combo is used for phones, tablets, desktop,
> or with other humidity and temperature parameters
> 
> for cars, robots, drones, etc...
> 
> Bye
> 
> Mild Shock schrieb:
>> Hi,
>>
>> For marketing purposes people
>> typically look at the race towards
>> 2nm, and we find:
>>
>> A month ago, Apple lost its exclusivity
>> on 3 nm smartphone processors with
>> MediaTek’s Dimensity 9400 chip, integrated
>> in the Vivo X200 Pro smartphone. Qualcomm
>> is also in the race with its recently
>> unveiled Snapdragon 8 Elite and set to
>> power the Xiaomi 15 Pro in 2025. However,
>> Apple should regain its position as innovation
>> leader in 2026 with the release of the
>> iPhone 18, which should feature the A20
>> chip built on TSMC’s 2 nm process."
>>
>> But there is a vertical vias revolution
>> going on as well, some SOCs typically
>> being at 18 layers now:
>>
>> Zooming Into a CPU (It's Incredible)
>> https://www.youtube.com/watch?v=Bez-2cvYja0
>>
>> imec has coined the term CMOS 2.0:
>>
>> LEUVEN (Belgium), MARCH 12th, 2026 — Imec,
>> a world-leading research and innovation hub
>> in advanced semiconductor technologies, has
>> launched a first-of-its-kind consortium with
>> 26 European university groups that will jointly
>> work on the technology roadmap beyond
>> CMOS scaling (CMOS 2.0).
>> https://www.imec-int.com/en/press/imec-launches-university-consortium-around-next-generation-chips 
>>
>>
>> So we might see more mobile grade GPUs.
>>
>> Bye
> 

Back to sci.physics | Previous | Next — Previous in thread | Next in thread | Find similar | Unroll thread

Thread

Economy of Maturation: Mobile HBM Coming! (Re: Creating a "European CMOS 2.0 Army") Mild Shock <janburse@fastmail.fm> - 2026-07-22 13:30 +0200
  3D RAM the new normal for SSDs [Mac Neo Case Study] (Re: Economy of Maturation: Mobile HBM Coming!) Mild Shock <janburse@fastmail.fm> - 2026-07-22 14:04 +0200
  Rossy Boy is confused : HBM != RDMA [UK Brexit Paranoids] (Re: Economy of Maturation: Mobile HBM Coming!) Mild Shock <janburse@fastmail.fm> - 2026-07-22 16:20 +0200
    Hardware engineering as a cyber crime conspiration (Was: Rossy Boy is confused : HBM != RDMA [UK Brexit Paranoids]) Mild Shock <janburse@fastmail.fm> - 2026-07-22 16:23 +0200
      Don't cruise gay bars, might end up like Alan Turing (Re: Hardware engineering as a cyber crime conspiration) Mild Shock <janburse@fastmail.fm> - 2026-07-22 16:28 +0200

csiph-web