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| Started by | Tao Wang <kevin.wangtao@hisilicon.com> |
|---|---|
| First post | 2017-08-29 10:30 +0200 |
| Last post | 2017-09-04 12:40 +0200 |
| Articles | 4 — 3 participants |
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[PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings Tao Wang <kevin.wangtao@hisilicon.com> - 2017-08-29 10:30 +0200
Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings Daniel Lezcano <daniel.lezcano@linaro.org> - 2017-08-31 20:30 +0200
Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings "Wangtao (Kevin, Kirin)" <kevin.wangtao@hisilicon.com> - 2017-09-04 08:40 +0200
Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings Daniel Lezcano <daniel.lezcano@linaro.org> - 2017-09-04 12:40 +0200
| From | Tao Wang <kevin.wangtao@hisilicon.com> |
|---|---|
| Date | 2017-08-29 10:30 +0200 |
| Subject | [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings |
| Message-ID | <ujK4i-f9-9@gated-at.bofh.it> |
From: Tao Wang <kevin.wangtao@linaro.org>
This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.
Signed-off-by: Tao Wang <kevin.wangtao@linaro.org>
---
.../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++
1 file changed, 37 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
new file mode 100644
index 0000000..4643dbe
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
@@ -0,0 +1,37 @@
+* Temperature Sensor on hisilicon SoC
+
+Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D
+area contains a temperture sensor. The temperture sensor produces an output
+value which has a linear relationship with the temperture of the area.
+
+for Hi3660,
+sensor0 monitors the temperture of A53;
+sensor1 monitors the temperture of A72;
+sensor2 monitors the temperture of GPU;
+sensor3 is a virtual sensor, which produces the maximum value of all sensors;
+sensor4 is a virtual sensor, which produces the average value of all sensors.
+
+** Required properties :
+- compatible: "hisilicon,thermal-tsensor".
+- reg: physical reg address of thermal sensor and length of memory mapped
+ region.
+- hisi,tsensors: number of hardware tsensors
+- hisi,coef: An array of integers (one signed cell) containing
+ coefficients to turn adc value to temperture.
+- hisi,adc-range: adc value range, minimum value is followed by maximum value.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+Hi3660:
+tsensor: tsensor@fff30000 {
+ compatible = "hisilicon,hi3660-tsensor";
+ #address-cells = <2>;
+ #size-cells = <2>;
+ reg = <0x0 0xfff3001c 0x0 0x4>,
+ <0x0 0xfff3005c 0x0 0x4>,
+ <0x0 0xfff3009c 0x0 0x4>;
+ hisi,tsensors = <HISI_MAX_TSENSORS>;
+ hisi,coef = <165000 (-40000)>;
+ hisi,adc-range = <0x74 0x39A>;
+ #thermal-sensor-cells = <1>;
+};
--
2.8.1
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| From | Daniel Lezcano <daniel.lezcano@linaro.org> |
|---|---|
| Date | 2017-08-31 20:30 +0200 |
| Subject | Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings |
| Message-ID | <ukCo1-Ik-11@gated-at.bofh.it> |
| In reply to | #1722215 |
On 29/08/2017 10:17, Tao Wang wrote:
> From: Tao Wang <kevin.wangtao@linaro.org>
>
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi3660 SoC.
>
> Signed-off-by: Tao Wang <kevin.wangtao@linaro.org>
> ---
> .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++
> 1 file changed, 37 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
>
> diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
> new file mode 100644
> index 0000000..4643dbe
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
> @@ -0,0 +1,37 @@
> +* Temperature Sensor on hisilicon SoC
> +
> +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D
> +area contains a temperture sensor. The temperture sensor produces an output
> +value which has a linear relationship with the temperture of the area.
> +
s/temperture/temperature/
> +for Hi3660,
> +sensor0 monitors the temperture of A53;
> +sensor1 monitors the temperture of A72;
> +sensor2 monitors the temperture of GPU;
> +sensor3 is a virtual sensor, which produces the maximum value of all sensors;
> +sensor4 is a virtual sensor, which produces the average value of all sensors.
I don't think we need to escribe the virtual sensors in the DT bindings.
> +** Required properties :
> +- compatible: "hisilicon,thermal-tsensor".
> +- reg: physical reg address of thermal sensor and length of memory mapped
> + region.
> +- hisi,tsensors: number of hardware tsensors
> +- hisi,coef: An array of integers (one signed cell) containing
> + coefficients to turn adc value to temperture.
> +- hisi,adc-range: adc value range, minimum value is followed by maximum value.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +Example :
> +Hi3660:
> +tsensor: tsensor@fff30000 {
> + compatible = "hisilicon,hi3660-tsensor";
> + #address-cells = <2>;
> + #size-cells = <2>;
> + reg = <0x0 0xfff3001c 0x0 0x4>,
> + <0x0 0xfff3005c 0x0 0x4>,
> + <0x0 0xfff3009c 0x0 0x4>;
> + hisi,tsensors = <HISI_MAX_TSENSORS>;
> + hisi,coef = <165000 (-40000)>;
> + hisi,adc-range = <0x74 0x39A>;
Do we really need max sensors, coef and adc range to be specified in the DT?
Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the
coef, adc, in the driver itself?
Can't this binding be merged with the hisilicon-thermal.txt?
Thanks.
-- Daniel
--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs
Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog
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| From | "Wangtao (Kevin, Kirin)" <kevin.wangtao@hisilicon.com> |
|---|---|
| Date | 2017-09-04 08:40 +0200 |
| Subject | Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings |
| Message-ID | <ulTd8-211-9@gated-at.bofh.it> |
| In reply to | #1724478 |
在 2017/9/1 2:24, Daniel Lezcano 写道:
> On 29/08/2017 10:17, Tao Wang wrote:
>> From: Tao Wang <kevin.wangtao@linaro.org>
>>
>> This adds documentation of device tree bindings for the
>> thermal sensor controller of hi3660 SoC.
>>
>> Signed-off-by: Tao Wang <kevin.wangtao@linaro.org>
>> ---
>> .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++++++++++++++++++++++
>> 1 file changed, 37 insertions(+)
>> create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
>>
>> diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
>> new file mode 100644
>> index 0000000..4643dbe
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
>> @@ -0,0 +1,37 @@
>> +* Temperature Sensor on hisilicon SoC
>> +
>> +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D
>> +area contains a temperture sensor. The temperture sensor produces an output
>> +value which has a linear relationship with the temperture of the area.
>> +
>
> s/temperture/temperature/
THX
>
>> +for Hi3660,
>> +sensor0 monitors the temperture of A53;
>> +sensor1 monitors the temperture of A72;
>> +sensor2 monitors the temperture of GPU;
>> +sensor3 is a virtual sensor, which produces the maximum value of all sensors;
>> +sensor4 is a virtual sensor, which produces the average value of all sensors.
>
> I don't think we need to escribe the virtual sensors in the DT bindings.
I just want to let user know the sensor id of virtual sensor, I also define it in header file, so the header file is enough?
>
>> +** Required properties :
>> +- compatible: "hisilicon,thermal-tsensor".
>> +- reg: physical reg address of thermal sensor and length of memory mapped
>> + region.
>> +- hisi,tsensors: number of hardware tsensors
>> +- hisi,coef: An array of integers (one signed cell) containing
>> + coefficients to turn adc value to temperture.
>> +- hisi,adc-range: adc value range, minimum value is followed by maximum value.
>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
>> +
>> +Example :
>> +Hi3660:
>> +tsensor: tsensor@fff30000 {
>> + compatible = "hisilicon,hi3660-tsensor";
>> + #address-cells = <2>;
>> + #size-cells = <2>;
>> + reg = <0x0 0xfff3001c 0x0 0x4>,
>> + <0x0 0xfff3005c 0x0 0x4>,
>> + <0x0 0xfff3009c 0x0 0x4>;
>> + hisi,tsensors = <HISI_MAX_TSENSORS>;
>> + hisi,coef = <165000 (-40000)>;
>> + hisi,adc-range = <0x74 0x39A>;
>
> Do we really need max sensors, coef and adc range to be specified in the DT?
>
> Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the
> coef, adc, in the driver itself?
My purpose is to make the driver be compitable with our future platform.
>
> Can't this binding be merged with the hisilicon-thermal.txt?
>
> Thanks.
>
> -- Daniel
>
>
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| From | Daniel Lezcano <daniel.lezcano@linaro.org> |
|---|---|
| Date | 2017-09-04 12:40 +0200 |
| Subject | Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings |
| Message-ID | <ulWXo-4m6-13@gated-at.bofh.it> |
| In reply to | #1725864 |
On 04/09/2017 08:39, Wangtao (Kevin, Kirin) wrote:
>
>
> 在 2017/9/1 2:24, Daniel Lezcano 写道:
>> On 29/08/2017 10:17, Tao Wang wrote:
>>> From: Tao Wang <kevin.wangtao@linaro.org>
>>>
>>> This adds documentation of device tree bindings for the
>>> thermal sensor controller of hi3660 SoC.
>>>
>>> Signed-off-by: Tao Wang <kevin.wangtao@linaro.org>
>>> ---
>>> .../devicetree/bindings/thermal/hisi-tsensor.txt | 37
>>> ++++++++++++++++++++++
>>> 1 file changed, 37 insertions(+)
>>> create mode 100644
>>> Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
>>>
>>> diff --git
>>> a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
>>> b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
>>> new file mode 100644
>>> index 0000000..4643dbe
>>> --- /dev/null
>>> +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
>>> @@ -0,0 +1,37 @@
>>> +* Temperature Sensor on hisilicon SoC
>>> +
>>> +Hisilicon SoC supplies temperature sensor feature, each CPU cluster
>>> and G3D
>>> +area contains a temperture sensor. The temperture sensor produces an
>>> output
>>> +value which has a linear relationship with the temperture of the area.
>>> +
>>
>> s/temperture/temperature/
> THX
>>
>>> +for Hi3660,
>>> +sensor0 monitors the temperture of A53;
>>> +sensor1 monitors the temperture of A72;
>>> +sensor2 monitors the temperture of GPU;
>>> +sensor3 is a virtual sensor, which produces the maximum value of all
>>> sensors;
>>> +sensor4 is a virtual sensor, which produces the average value of all
>>> sensors.
>>
>> I don't think we need to escribe the virtual sensors in the DT bindings.
> I just want to let user know the sensor id of virtual sensor, I also
> define it in header file, so the header file is enough?
The virtual sensor (or something else) should be a separate, generic
thing to be used for anyone.
>>> +** Required properties :
>>> +- compatible: "hisilicon,thermal-tsensor".
>>> +- reg: physical reg address of thermal sensor and length of memory
>>> mapped
>>> + region.
>>> +- hisi,tsensors: number of hardware tsensors
>>> +- hisi,coef: An array of integers (one signed cell) containing
>>> + coefficients to turn adc value to temperture.
>>> +- hisi,adc-range: adc value range, minimum value is followed by
>>> maximum value.
>>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a
>>> description.
>>> +
>>> +Example :
>>> +Hi3660:
>>> +tsensor: tsensor@fff30000 {
>>> + compatible = "hisilicon,hi3660-tsensor";
>>> + #address-cells = <2>;
>>> + #size-cells = <2>;
>>> + reg = <0x0 0xfff3001c 0x0 0x4>,
>>> + <0x0 0xfff3005c 0x0 0x4>,
>>> + <0x0 0xfff3009c 0x0 0x4>;
>>> + hisi,tsensors = <HISI_MAX_TSENSORS>;
>>> + hisi,coef = <165000 (-40000)>;
>>> + hisi,adc-range = <0x74 0x39A>;
>>
>> Do we really need max sensors, coef and adc range to be specified in
>> the DT?
>>
>> Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the
>> coef, adc, in the driver itself?
> My purpose is to make the driver be compitable with our future platform.
I don't see the point. The compatibility could be handled in the driver
itself, no?
--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs
Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog
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