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[PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

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  [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings Tao Wang <kevin.wangtao@hisilicon.com> - 2017-06-20 05:50 +0200
    [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660 Tao Wang <kevin.wangtao@hisilicon.com> - 2017-06-20 05:50 +0200
      Re: [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for  Hi3660 Wei Xu <xuwei5@hisilicon.com> - 2017-06-20 12:40 +0200
        Re: [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for  Hi3660 "Wangtao (Kevin, Kirin)" <kevin.wangtao@hisilicon.com> - 2017-06-21 04:30 +0200
      Re: [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for  Hi3660 Leo Yan <leo.yan@linaro.org> - 2017-06-21 04:40 +0200
    [PATCH 3/3] arm64: dts: register Hi3660's thermal sensor Tao Wang <kevin.wangtao@hisilicon.com> - 2017-06-20 05:50 +0200
      Re: [PATCH 3/3] arm64: dts: register Hi3660's thermal sensor "Wangtao (Kevin, Kirin)" <kevin.wangtao@hisilicon.com> - 2017-06-20 10:40 +0200
        Re: [PATCH 3/3] arm64: dts: register Hi3660's thermal sensor Guodong Xu <guodong.xu@linaro.org> - 2017-06-21 04:00 +0200
      [Patch v2 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660 Tao Wang <kevin.wangtao@hisilicon.com> - 2017-06-22 05:50 +0200
        Re: [Patch v2 2/3] thermal: hisilicon: add thermal sensor driver for  Hi3660 Eduardo Valentin <edubezval@gmail.com> - 2017-07-01 05:10 +0200
      [Patch v2 1/3] dt-bindings: Document the hi3660 thermal sensor bindings Tao Wang <kevin.wangtao@hisilicon.com> - 2017-06-22 05:50 +0200
        [Patch v2 3/3] arm64: dts: register Hi3660's thermal sensor Tao Wang <kevin.wangtao@hisilicon.com> - 2017-06-22 05:50 +0200
          Re: [Patch v2 3/3] arm64: dts: register Hi3660's thermal sensor Eduardo Valentin <edubezval@gmail.com> - 2017-07-01 05:10 +0200
        Re: [Patch v2 1/3] dt-bindings: Document the hi3660 thermal sensor  bindings Eduardo Valentin <edubezval@gmail.com> - 2017-07-01 05:10 +0200
    Re: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor  bindings Wei Xu <xuwei5@hisilicon.com> - 2017-06-20 12:30 +0200
      Re: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor  bindings "Wangtao (Kevin, Kirin)" <kevin.wangtao@hisilicon.com> - 2017-06-21 04:20 +0200

#1670234 — [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.

Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
---
 .../devicetree/bindings/thermal/hi3660-thermal.txt |   17 +++++++++++++++++
 1 file changed, 17 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt

diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
new file mode 100644
index 0000000..c034670
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
@@ -0,0 +1,17 @@
+* Temperature Sensor on hisilicon hi3660 SoC
+
+** Required properties :
+
+- compatible: "hisilicon,thermal-hi3660".
+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+
+	tsensor: tsensor {
+		compatible = "hisilicon,thermal-hi3660";
+		reg = <0x0 0xfff30000 0x0 0x1000>;
+		#thermal-sensor-cells = <1>;
+		status = "ok";
+	 };
-- 
1.7.9.5

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#1670235 — [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660

This patch adds the support for thermal sensor of Hi3660 SoC.
this will register sensors for thermal framework and use device
tree to bind cooling device.

Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
---
 drivers/thermal/Kconfig          |   10 ++
 drivers/thermal/Makefile         |    1 +
 drivers/thermal/hi3660_thermal.c |  198 ++++++++++++++++++++++++++++++++++++++
 3 files changed, 209 insertions(+)
 create mode 100644 drivers/thermal/hi3660_thermal.c

diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index b5b5fac..3e7fa95 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -203,6 +203,16 @@ config HISI_THERMAL
 	  thermal framework. cpufreq is used as the cooling device to throttle
 	  CPUs when the passive trip is crossed.
 
+config HI3660_THERMAL
+	tristate "Hi3660 thermal driver"
+	depends on ARCH_HISI || COMPILE_TEST
+	depends on HAS_IOMEM
+	depends on OF
+	default y
+	help
+	  Enable this to plug Hi3660 thermal driver into the Linux thermal
+	  framework.
+
 config IMX_THERMAL
 	tristate "Temperature sensor driver for Freescale i.MX SoCs"
 	depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 094d703..f29d0a5 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL)	+= intel_pch_thermal.o
 obj-$(CONFIG_ST_THERMAL)	+= st/
 obj-$(CONFIG_QCOM_TSENS)	+= qcom/
 obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra/
+obj-$(CONFIG_HI3660_THERMAL)	+= hi3660_thermal.o
 obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
 obj-$(CONFIG_MTK_THERMAL)	+= mtk_thermal.o
 obj-$(CONFIG_GENERIC_ADC_THERMAL)	+= thermal-generic-adc.o
diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
new file mode 100644
index 0000000..a538721
--- /dev/null
+++ b/drivers/thermal/hi3660_thermal.c
@@ -0,0 +1,198 @@
+/*
+ *  linux/drivers/thermal/hi3660_thermal.c
+ *
+ *  Copyright (c) 2017 Hisilicon Limited.
+ *  Copyright (c) 2017 Linaro Limited.
+ *
+ *  Author: Tao Wang <kevin.wangtao@hisilicon.com>
+ *  Author: Leo Yan <leo.yan@linaro.org>
+ *
+ *  This program is free software; you can redistribute it and/or modify
+ *  it under the terms of the GNU General Public License as published by
+ *  the Free Software Foundation; version 2 of the License.
+ *
+ *  This program is distributed in the hope that it will be useful,
+ *  but WITHOUT ANY WARRANTY; without even the implied warranty of
+ *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
+ *  GNU General Public License for more details.
+ *
+ *  You should have received a copy of the GNU General Public License
+ *  along with this program.  If not, see <http://www.gnu.org/licenses/>.
+ */
+
+#include <linux/clk.h>
+#include <linux/device.h>
+#include <linux/err.h>
+#include <linux/io.h>
+#include <linux/kernel.h>
+#include <linux/of.h>
+#include <linux/module.h>
+#include <linux/platform_device.h>
+#include <linux/thermal.h>
+
+#include "thermal_core.h"
+
+#define HW_MAX_SENSORS			4
+#define HISI_MAX_SENSORS		6
+#define SENSOR_MAX			4
+#define SENSOR_AVG			5
+
+#define ADC_MIN		116
+#define ADC_MAX		922
+
+/* hi3660 Thermal Sensor Dev Structure */
+struct hi3660_thermal_sensor {
+	struct hi3660_thermal_data *thermal;
+	struct thermal_zone_device *tzd;
+
+	uint32_t id;
+};
+
+struct hi3660_thermal_data {
+	struct platform_device *pdev;
+	struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
+	void __iomem *thermal_base;
+};
+
+unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
+
+
+static int hi3660_thermal_get_temp(void *_sensor, int *temp)
+{
+	struct hi3660_thermal_sensor *sensor = _sensor;
+	struct hi3660_thermal_data *data = sensor->thermal;
+	unsigned int idx;
+	int val, average = 0, max = 0;
+
+	if (sensor->id < HW_MAX_SENSORS) {
+		val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
+		val = clamp_val(val, ADC_MIN, ADC_MAX);
+	} else {
+		for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
+			val = readl(data->thermal_base
+					+ sensor_reg_offset[idx]);
+			val = clamp_val(val, ADC_MIN, ADC_MAX);
+			average += val;
+			if (val > max)
+				max = val;
+		}
+
+		if (sensor->id == SENSOR_MAX)
+			val = max;
+		else if (sensor->id == SENSOR_AVG)
+			val = average / HW_MAX_SENSORS;
+	}
+
+	*temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;
+
+	return 0;
+}
+
+static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
+	.get_temp = hi3660_thermal_get_temp,
+};
+
+static int hi3660_thermal_register_sensor(struct platform_device *pdev,
+		struct hi3660_thermal_data *data,
+		struct hi3660_thermal_sensor *sensor,
+		int index)
+{
+	int ret = 0;
+
+	sensor->id = index;
+	sensor->thermal = data;
+
+	sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
+				sensor->id, sensor, &hi3660_of_thermal_ops);
+	if (IS_ERR(sensor->tzd)) {
+		ret = PTR_ERR(sensor->tzd);
+		sensor->tzd = NULL;
+	}
+
+	return ret;
+}
+
+static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
+				       bool on)
+{
+	struct thermal_zone_device *tzd = sensor->tzd;
+
+	tzd->ops->set_mode(tzd,
+		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
+}
+
+static int hi3660_thermal_probe(struct platform_device *pdev)
+{
+	struct device *dev = &pdev->dev;
+	struct hi3660_thermal_data *data;
+	struct resource *res;
+	int ret = 0;
+	int i;
+
+	data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
+	if (!data)
+		return -ENOMEM;
+
+	data->pdev = pdev;
+	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
+	data->thermal_base = devm_ioremap_resource(dev, res);
+	if (IS_ERR(data->thermal_base)) {
+		dev_err(dev, "failed get reg base\n");
+		return -ENOMEM;
+	}
+
+	platform_set_drvdata(pdev, data);
+
+	for (i = 0; i < HISI_MAX_SENSORS; ++i) {
+		ret = hi3660_thermal_register_sensor(pdev, data,
+						     &data->sensors[i], i);
+		if (ret)
+			dev_err(&pdev->dev,
+				"failed to register thermal sensor%d: %d\n",
+				i, ret);
+		else
+			hi3660_thermal_toggle_sensor(&data->sensors[i], true);
+	}
+
+	dev_info(&pdev->dev, "Thermal Sensor Loaded\n");
+	return 0;
+}
+
+static int hi3660_thermal_exit(struct platform_device *pdev)
+{
+	struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
+	int i;
+
+	for (i = 0; i < HISI_MAX_SENSORS; i++) {
+		struct hi3660_thermal_sensor *sensor = &data->sensors[i];
+
+		if (!sensor->tzd)
+			continue;
+
+		hi3660_thermal_toggle_sensor(sensor, false);
+	}
+
+	return 0;
+}
+
+static const struct of_device_id hi3660_thermal_id_table[] = {
+	{ .compatible = "hisilicon,thermal-hi3660" },
+	{}
+};
+MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
+
+static struct platform_driver hi3660_thermal_driver = {
+	.probe = hi3660_thermal_probe,
+	.remove = hi3660_thermal_exit,
+	.driver = {
+		.name = "hi3660_thermal",
+		.of_match_table = hi3660_thermal_id_table,
+	},
+};
+
+module_platform_driver(hi3660_thermal_driver);
+
+MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>");
+MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
+MODULE_DESCRIPTION("hi3660 thermal driver");
+MODULE_LICENSE("GPL v2");
-- 
1.7.9.5

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#1670654 — Re: [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660

Hi Tao Wang,

On 2017/6/20 4:40, Tao Wang wrote:
> This patch adds the support for thermal sensor of Hi3660 SoC.
> this will register sensors for thermal framework and use device
> tree to bind cooling device.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> ---
>  drivers/thermal/Kconfig          |   10 ++
>  drivers/thermal/Makefile         |    1 +
>  drivers/thermal/hi3660_thermal.c |  198 ++++++++++++++++++++++++++++++++++++++
>  3 files changed, 209 insertions(+)
>  create mode 100644 drivers/thermal/hi3660_thermal.c
> 
> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
> index b5b5fac..3e7fa95 100644
> --- a/drivers/thermal/Kconfig
> +++ b/drivers/thermal/Kconfig
> @@ -203,6 +203,16 @@ config HISI_THERMAL
>  	  thermal framework. cpufreq is used as the cooling device to throttle
>  	  CPUs when the passive trip is crossed.
>  
> +config HI3660_THERMAL

Please keep alphabet order and swap the order
between HI3660_THERMAL and HISI_THERMAL.

Thanks!

BR,
Wei

> +	tristate "Hi3660 thermal driver"
> +	depends on ARCH_HISI || COMPILE_TEST
> +	depends on HAS_IOMEM
> +	depends on OF
> +	default y
> +	help
> +	  Enable this to plug Hi3660 thermal driver into the Linux thermal
> +	  framework.
> +
>  config IMX_THERMAL
>  	tristate "Temperature sensor driver for Freescale i.MX SoCs"
>  	depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
> index 094d703..f29d0a5 100644
> --- a/drivers/thermal/Makefile
> +++ b/drivers/thermal/Makefile
> @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL)	+= intel_pch_thermal.o
>  obj-$(CONFIG_ST_THERMAL)	+= st/
>  obj-$(CONFIG_QCOM_TSENS)	+= qcom/
>  obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra/
> +obj-$(CONFIG_HI3660_THERMAL)	+= hi3660_thermal.o
>  obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
>  obj-$(CONFIG_MTK_THERMAL)	+= mtk_thermal.o
>  obj-$(CONFIG_GENERIC_ADC_THERMAL)	+= thermal-generic-adc.o
> diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
> new file mode 100644
> index 0000000..a538721
> --- /dev/null
> +++ b/drivers/thermal/hi3660_thermal.c
> @@ -0,0 +1,198 @@
> +/*
> + *  linux/drivers/thermal/hi3660_thermal.c
> + *
> + *  Copyright (c) 2017 Hisilicon Limited.
> + *  Copyright (c) 2017 Linaro Limited.
> + *
> + *  Author: Tao Wang <kevin.wangtao@hisilicon.com>
> + *  Author: Leo Yan <leo.yan@linaro.org>
> + *
> + *  This program is free software; you can redistribute it and/or modify
> + *  it under the terms of the GNU General Public License as published by
> + *  the Free Software Foundation; version 2 of the License.
> + *
> + *  This program is distributed in the hope that it will be useful,
> + *  but WITHOUT ANY WARRANTY; without even the implied warranty of
> + *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
> + *  GNU General Public License for more details.
> + *
> + *  You should have received a copy of the GNU General Public License
> + *  along with this program.  If not, see <http://www.gnu.org/licenses/>.
> + */
> +
> +#include <linux/clk.h>
> +#include <linux/device.h>
> +#include <linux/err.h>
> +#include <linux/io.h>
> +#include <linux/kernel.h>
> +#include <linux/of.h>
> +#include <linux/module.h>
> +#include <linux/platform_device.h>
> +#include <linux/thermal.h>
> +
> +#include "thermal_core.h"
> +
> +#define HW_MAX_SENSORS			4
> +#define HISI_MAX_SENSORS		6
> +#define SENSOR_MAX			4
> +#define SENSOR_AVG			5
> +
> +#define ADC_MIN		116
> +#define ADC_MAX		922
> +
> +/* hi3660 Thermal Sensor Dev Structure */
> +struct hi3660_thermal_sensor {
> +	struct hi3660_thermal_data *thermal;
> +	struct thermal_zone_device *tzd;
> +
> +	uint32_t id;
> +};
> +
> +struct hi3660_thermal_data {
> +	struct platform_device *pdev;
> +	struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
> +	void __iomem *thermal_base;
> +};
> +
> +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
> +
> +
> +static int hi3660_thermal_get_temp(void *_sensor, int *temp)
> +{
> +	struct hi3660_thermal_sensor *sensor = _sensor;
> +	struct hi3660_thermal_data *data = sensor->thermal;
> +	unsigned int idx;
> +	int val, average = 0, max = 0;
> +
> +	if (sensor->id < HW_MAX_SENSORS) {
> +		val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
> +		val = clamp_val(val, ADC_MIN, ADC_MAX);
> +	} else {
> +		for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
> +			val = readl(data->thermal_base
> +					+ sensor_reg_offset[idx]);
> +			val = clamp_val(val, ADC_MIN, ADC_MAX);
> +			average += val;
> +			if (val > max)
> +				max = val;
> +		}
> +
> +		if (sensor->id == SENSOR_MAX)
> +			val = max;
> +		else if (sensor->id == SENSOR_AVG)
> +			val = average / HW_MAX_SENSORS;
> +	}
> +
> +	*temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;
> +
> +	return 0;
> +}
> +
> +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
> +	.get_temp = hi3660_thermal_get_temp,
> +};
> +
> +static int hi3660_thermal_register_sensor(struct platform_device *pdev,
> +		struct hi3660_thermal_data *data,
> +		struct hi3660_thermal_sensor *sensor,
> +		int index)
> +{
> +	int ret = 0;
> +
> +	sensor->id = index;
> +	sensor->thermal = data;
> +
> +	sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
> +				sensor->id, sensor, &hi3660_of_thermal_ops);
> +	if (IS_ERR(sensor->tzd)) {
> +		ret = PTR_ERR(sensor->tzd);
> +		sensor->tzd = NULL;
> +	}
> +
> +	return ret;
> +}
> +
> +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
> +				       bool on)
> +{
> +	struct thermal_zone_device *tzd = sensor->tzd;
> +
> +	tzd->ops->set_mode(tzd,
> +		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
> +}
> +
> +static int hi3660_thermal_probe(struct platform_device *pdev)
> +{
> +	struct device *dev = &pdev->dev;
> +	struct hi3660_thermal_data *data;
> +	struct resource *res;
> +	int ret = 0;
> +	int i;
> +
> +	data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
> +	if (!data)
> +		return -ENOMEM;
> +
> +	data->pdev = pdev;
> +	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
> +	data->thermal_base = devm_ioremap_resource(dev, res);
> +	if (IS_ERR(data->thermal_base)) {
> +		dev_err(dev, "failed get reg base\n");
> +		return -ENOMEM;
> +	}
> +
> +	platform_set_drvdata(pdev, data);
> +
> +	for (i = 0; i < HISI_MAX_SENSORS; ++i) {
> +		ret = hi3660_thermal_register_sensor(pdev, data,
> +						     &data->sensors[i], i);
> +		if (ret)
> +			dev_err(&pdev->dev,
> +				"failed to register thermal sensor%d: %d\n",
> +				i, ret);
> +		else
> +			hi3660_thermal_toggle_sensor(&data->sensors[i], true);
> +	}
> +
> +	dev_info(&pdev->dev, "Thermal Sensor Loaded\n");
> +	return 0;
> +}
> +
> +static int hi3660_thermal_exit(struct platform_device *pdev)
> +{
> +	struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
> +	int i;
> +
> +	for (i = 0; i < HISI_MAX_SENSORS; i++) {
> +		struct hi3660_thermal_sensor *sensor = &data->sensors[i];
> +
> +		if (!sensor->tzd)
> +			continue;
> +
> +		hi3660_thermal_toggle_sensor(sensor, false);
> +	}
> +
> +	return 0;
> +}
> +
> +static const struct of_device_id hi3660_thermal_id_table[] = {
> +	{ .compatible = "hisilicon,thermal-hi3660" },
> +	{}
> +};
> +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
> +
> +static struct platform_driver hi3660_thermal_driver = {
> +	.probe = hi3660_thermal_probe,
> +	.remove = hi3660_thermal_exit,
> +	.driver = {
> +		.name = "hi3660_thermal",
> +		.of_match_table = hi3660_thermal_id_table,
> +	},
> +};
> +
> +module_platform_driver(hi3660_thermal_driver);
> +
> +MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>");
> +MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
> +MODULE_DESCRIPTION("hi3660 thermal driver");
> +MODULE_LICENSE("GPL v2");
> 

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#1671292 — Re: [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660

e( 2017/6/20 18:31, Wei Xu ei
:
> Hi Tao Wang,
> 
> On 2017/6/20 4:40, Tao Wang wrote:
>> This patch adds the support for thermal sensor of Hi3660 SoC.
>> this will register sensors for thermal framework and use device
>> tree to bind cooling device.
>>
>> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
>> Signed-off-by: Leo Yan <leo.yan@linaro.org>
>> ---
>>   drivers/thermal/Kconfig          |   10 ++
>>   drivers/thermal/Makefile         |    1 +
>>   drivers/thermal/hi3660_thermal.c |  198 ++++++++++++++++++++++++++++++++++++++
>>   3 files changed, 209 insertions(+)
>>   create mode 100644 drivers/thermal/hi3660_thermal.c
>>
>> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
>> index b5b5fac..3e7fa95 100644
>> --- a/drivers/thermal/Kconfig
>> +++ b/drivers/thermal/Kconfig
>> @@ -203,6 +203,16 @@ config HISI_THERMAL
>>   	  thermal framework. cpufreq is used as the cooling device to throttle
>>   	  CPUs when the passive trip is crossed.
>>   
>> +config HI3660_THERMAL
> 
> Please keep alphabet order and swap the order
> between HI3660_THERMAL and HISI_THERMAL.
OK
> 
> Thanks!
> 
> BR,
> Wei
> 
>> +	tristate "Hi3660 thermal driver"
>> +	depends on ARCH_HISI || COMPILE_TEST
>> +	depends on HAS_IOMEM
>> +	depends on OF
>> +	default y
>> +	help
>> +	  Enable this to plug Hi3660 thermal driver into the Linux thermal
>> +	  framework.
>> +
>>   config IMX_THERMAL
>>   	tristate "Temperature sensor driver for Freescale i.MX SoCs"
>>   	depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
>> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
>> index 094d703..f29d0a5 100644
>> --- a/drivers/thermal/Makefile
>> +++ b/drivers/thermal/Makefile
>> @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL)	+= intel_pch_thermal.o
>>   obj-$(CONFIG_ST_THERMAL)	+= st/
>>   obj-$(CONFIG_QCOM_TSENS)	+= qcom/
>>   obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra/
>> +obj-$(CONFIG_HI3660_THERMAL)	+= hi3660_thermal.o
>>   obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
>>   obj-$(CONFIG_MTK_THERMAL)	+= mtk_thermal.o
>>   obj-$(CONFIG_GENERIC_ADC_THERMAL)	+= thermal-generic-adc.o
>> diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
>> new file mode 100644
>> index 0000000..a538721
>> --- /dev/null
>> +++ b/drivers/thermal/hi3660_thermal.c
>> @@ -0,0 +1,198 @@
>> +/*
>> + *  linux/drivers/thermal/hi3660_thermal.c
>> + *
>> + *  Copyright (c) 2017 Hisilicon Limited.
>> + *  Copyright (c) 2017 Linaro Limited.
>> + *
>> + *  Author: Tao Wang <kevin.wangtao@hisilicon.com>
>> + *  Author: Leo Yan <leo.yan@linaro.org>
>> + *
>> + *  This program is free software; you can redistribute it and/or modify
>> + *  it under the terms of the GNU General Public License as published by
>> + *  the Free Software Foundation; version 2 of the License.
>> + *
>> + *  This program is distributed in the hope that it will be useful,
>> + *  but WITHOUT ANY WARRANTY; without even the implied warranty of
>> + *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
>> + *  GNU General Public License for more details.
>> + *
>> + *  You should have received a copy of the GNU General Public License
>> + *  along with this program.  If not, see <http://www.gnu.org/licenses/>.
>> + */
>> +
>> +#include <linux/clk.h>
>> +#include <linux/device.h>
>> +#include <linux/err.h>
>> +#include <linux/io.h>
>> +#include <linux/kernel.h>
>> +#include <linux/of.h>
>> +#include <linux/module.h>
>> +#include <linux/platform_device.h>
>> +#include <linux/thermal.h>
>> +
>> +#include "thermal_core.h"
>> +
>> +#define HW_MAX_SENSORS			4
>> +#define HISI_MAX_SENSORS		6
>> +#define SENSOR_MAX			4
>> +#define SENSOR_AVG			5
>> +
>> +#define ADC_MIN		116
>> +#define ADC_MAX		922
>> +
>> +/* hi3660 Thermal Sensor Dev Structure */
>> +struct hi3660_thermal_sensor {
>> +	struct hi3660_thermal_data *thermal;
>> +	struct thermal_zone_device *tzd;
>> +
>> +	uint32_t id;
>> +};
>> +
>> +struct hi3660_thermal_data {
>> +	struct platform_device *pdev;
>> +	struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
>> +	void __iomem *thermal_base;
>> +};
>> +
>> +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
>> +
>> +
>> +static int hi3660_thermal_get_temp(void *_sensor, int *temp)
>> +{
>> +	struct hi3660_thermal_sensor *sensor = _sensor;
>> +	struct hi3660_thermal_data *data = sensor->thermal;
>> +	unsigned int idx;
>> +	int val, average = 0, max = 0;
>> +
>> +	if (sensor->id < HW_MAX_SENSORS) {
>> +		val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
>> +		val = clamp_val(val, ADC_MIN, ADC_MAX);
>> +	} else {
>> +		for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
>> +			val = readl(data->thermal_base
>> +					+ sensor_reg_offset[idx]);
>> +			val = clamp_val(val, ADC_MIN, ADC_MAX);
>> +			average += val;
>> +			if (val > max)
>> +				max = val;
>> +		}
>> +
>> +		if (sensor->id == SENSOR_MAX)
>> +			val = max;
>> +		else if (sensor->id == SENSOR_AVG)
>> +			val = average / HW_MAX_SENSORS;
>> +	}
>> +
>> +	*temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;
>> +
>> +	return 0;
>> +}
>> +
>> +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
>> +	.get_temp = hi3660_thermal_get_temp,
>> +};
>> +
>> +static int hi3660_thermal_register_sensor(struct platform_device *pdev,
>> +		struct hi3660_thermal_data *data,
>> +		struct hi3660_thermal_sensor *sensor,
>> +		int index)
>> +{
>> +	int ret = 0;
>> +
>> +	sensor->id = index;
>> +	sensor->thermal = data;
>> +
>> +	sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
>> +				sensor->id, sensor, &hi3660_of_thermal_ops);
>> +	if (IS_ERR(sensor->tzd)) {
>> +		ret = PTR_ERR(sensor->tzd);
>> +		sensor->tzd = NULL;
>> +	}
>> +
>> +	return ret;
>> +}
>> +
>> +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
>> +				       bool on)
>> +{
>> +	struct thermal_zone_device *tzd = sensor->tzd;
>> +
>> +	tzd->ops->set_mode(tzd,
>> +		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
>> +}
>> +
>> +static int hi3660_thermal_probe(struct platform_device *pdev)
>> +{
>> +	struct device *dev = &pdev->dev;
>> +	struct hi3660_thermal_data *data;
>> +	struct resource *res;
>> +	int ret = 0;
>> +	int i;
>> +
>> +	data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
>> +	if (!data)
>> +		return -ENOMEM;
>> +
>> +	data->pdev = pdev;
>> +	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
>> +	data->thermal_base = devm_ioremap_resource(dev, res);
>> +	if (IS_ERR(data->thermal_base)) {
>> +		dev_err(dev, "failed get reg base\n");
>> +		return -ENOMEM;
>> +	}
>> +
>> +	platform_set_drvdata(pdev, data);
>> +
>> +	for (i = 0; i < HISI_MAX_SENSORS; ++i) {
>> +		ret = hi3660_thermal_register_sensor(pdev, data,
>> +						     &data->sensors[i], i);
>> +		if (ret)
>> +			dev_err(&pdev->dev,
>> +				"failed to register thermal sensor%d: %d\n",
>> +				i, ret);
>> +		else
>> +			hi3660_thermal_toggle_sensor(&data->sensors[i], true);
>> +	}
>> +
>> +	dev_info(&pdev->dev, "Thermal Sensor Loaded\n");
>> +	return 0;
>> +}
>> +
>> +static int hi3660_thermal_exit(struct platform_device *pdev)
>> +{
>> +	struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
>> +	int i;
>> +
>> +	for (i = 0; i < HISI_MAX_SENSORS; i++) {
>> +		struct hi3660_thermal_sensor *sensor = &data->sensors[i];
>> +
>> +		if (!sensor->tzd)
>> +			continue;
>> +
>> +		hi3660_thermal_toggle_sensor(sensor, false);
>> +	}
>> +
>> +	return 0;
>> +}
>> +
>> +static const struct of_device_id hi3660_thermal_id_table[] = {
>> +	{ .compatible = "hisilicon,thermal-hi3660" },
>> +	{}
>> +};
>> +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
>> +
>> +static struct platform_driver hi3660_thermal_driver = {
>> +	.probe = hi3660_thermal_probe,
>> +	.remove = hi3660_thermal_exit,
>> +	.driver = {
>> +		.name = "hi3660_thermal",
>> +		.of_match_table = hi3660_thermal_id_table,
>> +	},
>> +};
>> +
>> +module_platform_driver(hi3660_thermal_driver);
>> +
>> +MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>");
>> +MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
>> +MODULE_DESCRIPTION("hi3660 thermal driver");
>> +MODULE_LICENSE("GPL v2");
>>
> 
> 
> .
> 

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#1671294 — Re: [PATCH 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660

Hi Rui, Eduardo,

On Tue, Jun 20, 2017 at 11:40:34AM +0800, Tao Wang wrote:

[...]

> diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
> new file mode 100644
> index 0000000..a538721
> --- /dev/null
> +++ b/drivers/thermal/hi3660_thermal.c
> @@ -0,0 +1,198 @@
> +/*
> + *  linux/drivers/thermal/hi3660_thermal.c
> + *
> + *  Copyright (c) 2017 Hisilicon Limited.
> + *  Copyright (c) 2017 Linaro Limited.
> + *
> + *  Author: Tao Wang <kevin.wangtao@hisilicon.com>
> + *  Author: Leo Yan <leo.yan@linaro.org>
> + *
> + *  This program is free software; you can redistribute it and/or modify
> + *  it under the terms of the GNU General Public License as published by
> + *  the Free Software Foundation; version 2 of the License.
> + *
> + *  This program is distributed in the hope that it will be useful,
> + *  but WITHOUT ANY WARRANTY; without even the implied warranty of
> + *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
> + *  GNU General Public License for more details.
> + *
> + *  You should have received a copy of the GNU General Public License
> + *  along with this program.  If not, see <http://www.gnu.org/licenses/>.
> + */
> +
> +#include <linux/clk.h>
> +#include <linux/device.h>
> +#include <linux/err.h>
> +#include <linux/io.h>
> +#include <linux/kernel.h>
> +#include <linux/of.h>
> +#include <linux/module.h>
> +#include <linux/platform_device.h>
> +#include <linux/thermal.h>
> +
> +#include "thermal_core.h"
> +
> +#define HW_MAX_SENSORS			4
> +#define HISI_MAX_SENSORS		6
> +#define SENSOR_MAX			4
> +#define SENSOR_AVG			5
> +
> +#define ADC_MIN		116
> +#define ADC_MAX		922
> +
> +/* hi3660 Thermal Sensor Dev Structure */
> +struct hi3660_thermal_sensor {
> +	struct hi3660_thermal_data *thermal;
> +	struct thermal_zone_device *tzd;
> +
> +	uint32_t id;
> +};
> +
> +struct hi3660_thermal_data {
> +	struct platform_device *pdev;
> +	struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
> +	void __iomem *thermal_base;
> +};
> +
> +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
> +
> +
> +static int hi3660_thermal_get_temp(void *_sensor, int *temp)
> +{
> +	struct hi3660_thermal_sensor *sensor = _sensor;
> +	struct hi3660_thermal_data *data = sensor->thermal;
> +	unsigned int idx;
> +	int val, average = 0, max = 0;
> +
> +	if (sensor->id < HW_MAX_SENSORS) {
> +		val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
> +		val = clamp_val(val, ADC_MIN, ADC_MAX);
> +	} else {
> +		for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
> +			val = readl(data->thermal_base
> +					+ sensor_reg_offset[idx]);
> +			val = clamp_val(val, ADC_MIN, ADC_MAX);
> +			average += val;
> +			if (val > max)
> +				max = val;
> +		}
> +
> +		if (sensor->id == SENSOR_MAX)
> +			val = max;
> +		else if (sensor->id == SENSOR_AVG)
> +			val = average / HW_MAX_SENSORS;
> +	}

I think here have one thing it's better to check with you ahead and
want your suggestions.

Tao adds two 'software' sensors, one is sensor 4 which is used to
present the maximum temperature value crossing from sensor 0 ~ 3; and
another sensor 4 is used to present the average temperature value.

Does this make sense for you?

> +	*temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;
> +
> +	return 0;
> +}
> +
> +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
> +	.get_temp = hi3660_thermal_get_temp,
> +};
> +
> +static int hi3660_thermal_register_sensor(struct platform_device *pdev,
> +		struct hi3660_thermal_data *data,
> +		struct hi3660_thermal_sensor *sensor,
> +		int index)
> +{
> +	int ret = 0;
> +
> +	sensor->id = index;
> +	sensor->thermal = data;
> +
> +	sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
> +				sensor->id, sensor, &hi3660_of_thermal_ops);
> +	if (IS_ERR(sensor->tzd)) {
> +		ret = PTR_ERR(sensor->tzd);
> +		sensor->tzd = NULL;
> +	}
> +
> +	return ret;
> +}
> +
> +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
> +				       bool on)
> +{
> +	struct thermal_zone_device *tzd = sensor->tzd;
> +
> +	tzd->ops->set_mode(tzd,
> +		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
> +}
> +
> +static int hi3660_thermal_probe(struct platform_device *pdev)
> +{
> +	struct device *dev = &pdev->dev;
> +	struct hi3660_thermal_data *data;
> +	struct resource *res;
> +	int ret = 0;
> +	int i;
> +
> +	data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
> +	if (!data)
> +		return -ENOMEM;
> +
> +	data->pdev = pdev;
> +	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
> +	data->thermal_base = devm_ioremap_resource(dev, res);
> +	if (IS_ERR(data->thermal_base)) {
> +		dev_err(dev, "failed get reg base\n");
> +		return -ENOMEM;
> +	}
> +
> +	platform_set_drvdata(pdev, data);
> +
> +	for (i = 0; i < HISI_MAX_SENSORS; ++i) {
> +		ret = hi3660_thermal_register_sensor(pdev, data,
> +						     &data->sensors[i], i);
> +		if (ret)
> +			dev_err(&pdev->dev,
> +				"failed to register thermal sensor%d: %d\n",
> +				i, ret);
> +		else
> +			hi3660_thermal_toggle_sensor(&data->sensors[i], true);
> +	}
> +
> +	dev_info(&pdev->dev, "Thermal Sensor Loaded\n");
> +	return 0;
> +}
> +
> +static int hi3660_thermal_exit(struct platform_device *pdev)
> +{
> +	struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
> +	int i;
> +
> +	for (i = 0; i < HISI_MAX_SENSORS; i++) {
> +		struct hi3660_thermal_sensor *sensor = &data->sensors[i];
> +
> +		if (!sensor->tzd)
> +			continue;
> +
> +		hi3660_thermal_toggle_sensor(sensor, false);
> +	}
> +
> +	return 0;
> +}
> +
> +static const struct of_device_id hi3660_thermal_id_table[] = {
> +	{ .compatible = "hisilicon,thermal-hi3660" },
> +	{}
> +};
> +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
> +
> +static struct platform_driver hi3660_thermal_driver = {
> +	.probe = hi3660_thermal_probe,
> +	.remove = hi3660_thermal_exit,
> +	.driver = {
> +		.name = "hi3660_thermal",
> +		.of_match_table = hi3660_thermal_id_table,
> +	},
> +};
> +
> +module_platform_driver(hi3660_thermal_driver);
> +
> +MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>");
> +MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
> +MODULE_DESCRIPTION("hi3660 thermal driver");
> +MODULE_LICENSE("GPL v2");
> -- 
> 1.7.9.5
> 

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#1670242 — [PATCH 3/3] arm64: dts: register Hi3660's thermal sensor

Bind thermal sensor driver for Hi3660.

Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
---
 arch/arm64/boot/dts/hisilicon/hi3660.dtsi |    7 +++++++
 1 file changed, 7 insertions(+)

diff --git a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
index 3983086..cc67958 100644
--- a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
+++ b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
@@ -156,5 +156,12 @@
 			clock-names = "uartclk", "apb_pclk";
 			status = "disabled";
 		};
+
+		tsensor: tsensor {
+			compatible = "hisilicon,thermal-hi3660";
+			reg = <0x0 0xfff30000 0x0 0x1000>;
+			#thermal-sensor-cells = <1>;
+			status = "ok";
+		};
 	};
 };
-- 
1.7.9.5

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#1670428 — Re: [PATCH 3/3] arm64: dts: register Hi3660's thermal sensor

在 2017/6/20 15:38, Guodong Xu 写道:
> 
> 
> 2017年6月20日 上午11:49，"Tao Wang" <kevin.wangtao@hisilicon.com <mailto:kevin.wangtao@hisilicon.com>>写道：
> 
>     Bind thermal sensor driver for Hi3660.
> 
>     Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com <mailto:kevin.wangtao@hisilicon.com>>
>     Signed-off-by: Leo Yan <leo.yan@linaro.org <mailto:leo.yan@linaro.org>>
>     ---
>       arch/arm64/boot/dts/hisilicon/hi3660.dtsi |    7 +++++++
>       1 file changed, 7 insertions(+)
> 
>     diff --git a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
>     index 3983086..cc67958 100644
>     --- a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
>     +++ b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
>     @@ -156,5 +156,12 @@
> 
> 
> i am wondering which tree this patch should be applied to. Actually Olof Johansson olof@lixom.net <mailto:olof@lixom.net> just merged hi3660 dts into his tree. You should better rebase you dts patch onto that.
Can you share me the git path?
> 
> 
>                              clock-names = "uartclk", "apb_pclk";
>                              status = "disabled";
>                      };
>     +
>     +               tsensor: tsensor {
>     +                       compatible = "hisilicon,thermal-hi3660";
>     +                       reg = <0x0 0xfff30000 0x0 0x1000>;
>     +                       #thermal-sensor-cells = <1>;
>     +                       status = "ok";
> 
> 
> please remove status ok. that's default. redundant.
ok
> 
>     +               };
>              };
>       };
>     --
>     1.7.9.5
> 
> 
>     _______________________________________________
>     linux-arm-kernel mailing list
>     linux-arm-kernel@lists.infradead.org <mailto:linux-arm-kernel@lists.infradead.org>
>     http://lists.infradead.org/mailman/listinfo/linux-arm-kernel <http://lists.infradead.org/mailman/listinfo/linux-arm-kernel>
> 
> 

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#1671285 — Re: [PATCH 3/3] arm64: dts: register Hi3660's thermal sensor

On Tue, Jun 20, 2017 at 4:32 PM, Wangtao (Kevin, Kirin)
<kevin.wangtao@hisilicon.com> wrote:
>
>
> 在 2017/6/20 15:38, Guodong Xu 写道:
>>
>>
>>
>> 2017年6月20日 上午11:49，"Tao Wang" <kevin.wangtao@hisilicon.com
>> <mailto:kevin.wangtao@hisilicon.com>>写道：
>>
>>     Bind thermal sensor driver for Hi3660.
>>
>>     Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com
>> <mailto:kevin.wangtao@hisilicon.com>>
>>     Signed-off-by: Leo Yan <leo.yan@linaro.org
>> <mailto:leo.yan@linaro.org>>
>>     ---
>>       arch/arm64/boot/dts/hisilicon/hi3660.dtsi |    7 +++++++
>>       1 file changed, 7 insertions(+)
>>
>>     diff --git a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
>> b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
>>     index 3983086..cc67958 100644
>>     --- a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
>>     +++ b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
>>     @@ -156,5 +156,12 @@
>>
>>
>> i am wondering which tree this patch should be applied to. Actually Olof
>> Johansson olof@lixom.net <mailto:olof@lixom.net> just merged hi3660 dts into
>> his tree. You should better rebase you dts patch onto that.
>
> Can you share me the git path?

As of this morning, it has shown up in linux next tag: next-20170620

https://git.kernel.org/pub/scm/linux/kernel/git/next/linux-next.git/tree/arch/arm64/boot/dts/hisilicon?h=next-20170620

-Guodong


>>
>>
>>
>>                              clock-names = "uartclk", "apb_pclk";
>>                              status = "disabled";
>>                      };
>>     +
>>     +               tsensor: tsensor {
>>     +                       compatible = "hisilicon,thermal-hi3660";
>>     +                       reg = <0x0 0xfff30000 0x0 0x1000>;
>>     +                       #thermal-sensor-cells = <1>;
>>     +                       status = "ok";
>>
>>
>> please remove status ok. that's default. redundant.
>
> ok
>>
>>
>>     +               };
>>              };
>>       };
>>     --
>>     1.7.9.5
>>
>>
>>     _______________________________________________
>>     linux-arm-kernel mailing list
>>     linux-arm-kernel@lists.infradead.org
>> <mailto:linux-arm-kernel@lists.infradead.org>
>>     http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
>> <http://lists.infradead.org/mailman/listinfo/linux-arm-kernel>
>>
>>
>

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#1672282 — [Patch v2 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660

This patch adds the support for thermal sensor of Hi3660 SoC.
this will register sensors for thermal framework and use device
tree to bind cooling device.

Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
---
Changes in v2:
- correct alphabet order
- correct compatible name

 drivers/thermal/Kconfig          |   10 ++
 drivers/thermal/Makefile         |    1 +
 drivers/thermal/hi3660_thermal.c |  198 ++++++++++++++++++++++++++++++++++++++
 3 files changed, 209 insertions(+)
 create mode 100644 drivers/thermal/hi3660_thermal.c

diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
index b5b5fac..ed22a90 100644
--- a/drivers/thermal/Kconfig
+++ b/drivers/thermal/Kconfig
@@ -192,6 +192,16 @@ config THERMAL_EMULATION
 	  because userland can easily disable the thermal policy by simply
 	  flooding this sysfs node with low temperature values.
 
+config HI3660_THERMAL
+	tristate "Hi3660 thermal driver"
+	depends on ARCH_HISI || COMPILE_TEST
+	depends on HAS_IOMEM
+	depends on OF
+	default y
+	help
+	  Enable this to plug Hi3660 thermal driver into the Linux thermal
+	  framework.
+
 config HISI_THERMAL
 	tristate "Hisilicon thermal driver"
 	depends on ARCH_HISI || COMPILE_TEST
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 094d703..f29d0a5 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL)	+= intel_pch_thermal.o
 obj-$(CONFIG_ST_THERMAL)	+= st/
 obj-$(CONFIG_QCOM_TSENS)	+= qcom/
 obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra/
+obj-$(CONFIG_HI3660_THERMAL)	+= hi3660_thermal.o
 obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
 obj-$(CONFIG_MTK_THERMAL)	+= mtk_thermal.o
 obj-$(CONFIG_GENERIC_ADC_THERMAL)	+= thermal-generic-adc.o
diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
new file mode 100644
index 0000000..68fa9018
--- /dev/null
+++ b/drivers/thermal/hi3660_thermal.c
@@ -0,0 +1,198 @@
+/*
+ *  linux/drivers/thermal/hi3660_thermal.c
+ *
+ *  Copyright (c) 2017 Hisilicon Limited.
+ *  Copyright (c) 2017 Linaro Limited.
+ *
+ *  Author: Tao Wang <kevin.wangtao@hisilicon.com>
+ *  Author: Leo Yan <leo.yan@linaro.org>
+ *
+ *  This program is free software; you can redistribute it and/or modify
+ *  it under the terms of the GNU General Public License as published by
+ *  the Free Software Foundation; version 2 of the License.
+ *
+ *  This program is distributed in the hope that it will be useful,
+ *  but WITHOUT ANY WARRANTY; without even the implied warranty of
+ *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
+ *  GNU General Public License for more details.
+ *
+ *  You should have received a copy of the GNU General Public License
+ *  along with this program.  If not, see <http://www.gnu.org/licenses/>.
+ */
+
+#include <linux/clk.h>
+#include <linux/device.h>
+#include <linux/err.h>
+#include <linux/io.h>
+#include <linux/kernel.h>
+#include <linux/of.h>
+#include <linux/module.h>
+#include <linux/platform_device.h>
+#include <linux/thermal.h>
+
+#include "thermal_core.h"
+
+#define HW_MAX_SENSORS			4
+#define HISI_MAX_SENSORS		6
+#define SENSOR_MAX			4
+#define SENSOR_AVG			5
+
+#define ADC_MIN		116
+#define ADC_MAX		922
+
+/* hi3660 Thermal Sensor Dev Structure */
+struct hi3660_thermal_sensor {
+	struct hi3660_thermal_data *thermal;
+	struct thermal_zone_device *tzd;
+
+	uint32_t id;
+};
+
+struct hi3660_thermal_data {
+	struct platform_device *pdev;
+	struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
+	void __iomem *thermal_base;
+};
+
+unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
+
+
+static int hi3660_thermal_get_temp(void *_sensor, int *temp)
+{
+	struct hi3660_thermal_sensor *sensor = _sensor;
+	struct hi3660_thermal_data *data = sensor->thermal;
+	unsigned int idx;
+	int val, average = 0, max = 0;
+
+	if (sensor->id < HW_MAX_SENSORS) {
+		val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
+		val = clamp_val(val, ADC_MIN, ADC_MAX);
+	} else {
+		for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
+			val = readl(data->thermal_base
+					+ sensor_reg_offset[idx]);
+			val = clamp_val(val, ADC_MIN, ADC_MAX);
+			average += val;
+			if (val > max)
+				max = val;
+		}
+
+		if (sensor->id == SENSOR_MAX)
+			val = max;
+		else if (sensor->id == SENSOR_AVG)
+			val = average / HW_MAX_SENSORS;
+	}
+
+	*temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;
+
+	return 0;
+}
+
+static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
+	.get_temp = hi3660_thermal_get_temp,
+};
+
+static int hi3660_thermal_register_sensor(struct platform_device *pdev,
+		struct hi3660_thermal_data *data,
+		struct hi3660_thermal_sensor *sensor,
+		int index)
+{
+	int ret = 0;
+
+	sensor->id = index;
+	sensor->thermal = data;
+
+	sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
+				sensor->id, sensor, &hi3660_of_thermal_ops);
+	if (IS_ERR(sensor->tzd)) {
+		ret = PTR_ERR(sensor->tzd);
+		sensor->tzd = NULL;
+	}
+
+	return ret;
+}
+
+static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
+				       bool on)
+{
+	struct thermal_zone_device *tzd = sensor->tzd;
+
+	tzd->ops->set_mode(tzd,
+		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
+}
+
+static int hi3660_thermal_probe(struct platform_device *pdev)
+{
+	struct device *dev = &pdev->dev;
+	struct hi3660_thermal_data *data;
+	struct resource *res;
+	int ret = 0;
+	int i;
+
+	data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
+	if (!data)
+		return -ENOMEM;
+
+	data->pdev = pdev;
+	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
+	data->thermal_base = devm_ioremap_resource(dev, res);
+	if (IS_ERR(data->thermal_base)) {
+		dev_err(dev, "failed get reg base\n");
+		return -ENOMEM;
+	}
+
+	platform_set_drvdata(pdev, data);
+
+	for (i = 0; i < HISI_MAX_SENSORS; ++i) {
+		ret = hi3660_thermal_register_sensor(pdev, data,
+						     &data->sensors[i], i);
+		if (ret)
+			dev_err(&pdev->dev,
+				"failed to register thermal sensor%d: %d\n",
+				i, ret);
+		else
+			hi3660_thermal_toggle_sensor(&data->sensors[i], true);
+	}
+
+	dev_info(&pdev->dev, "Thermal Sensor Loaded\n");
+	return 0;
+}
+
+static int hi3660_thermal_exit(struct platform_device *pdev)
+{
+	struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
+	int i;
+
+	for (i = 0; i < HISI_MAX_SENSORS; i++) {
+		struct hi3660_thermal_sensor *sensor = &data->sensors[i];
+
+		if (!sensor->tzd)
+			continue;
+
+		hi3660_thermal_toggle_sensor(sensor, false);
+	}
+
+	return 0;
+}
+
+static const struct of_device_id hi3660_thermal_id_table[] = {
+	{ .compatible = "hisilicon,hi3660-thermal" },
+	{}
+};
+MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
+
+static struct platform_driver hi3660_thermal_driver = {
+	.probe = hi3660_thermal_probe,
+	.remove = hi3660_thermal_exit,
+	.driver = {
+		.name = "hi3660_thermal",
+		.of_match_table = hi3660_thermal_id_table,
+	},
+};
+
+module_platform_driver(hi3660_thermal_driver);
+
+MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>");
+MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
+MODULE_DESCRIPTION("hi3660 thermal driver");
+MODULE_LICENSE("GPL v2");
-- 
1.7.9.5

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#1679253 — Re: [Patch v2 2/3] thermal: hisilicon: add thermal sensor driver for Hi3660

Hey Tao,

On Thu, Jun 22, 2017 at 11:42:02AM +0800, Tao Wang wrote:
> This patch adds the support for thermal sensor of Hi3660 SoC.
> this will register sensors for thermal framework and use device
> tree to bind cooling device.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> ---
> Changes in v2:
> - correct alphabet order
> - correct compatible name
> 
>  drivers/thermal/Kconfig          |   10 ++
>  drivers/thermal/Makefile         |    1 +
>  drivers/thermal/hi3660_thermal.c |  198 ++++++++++++++++++++++++++++++++++++++
>  3 files changed, 209 insertions(+)
>  create mode 100644 drivers/thermal/hi3660_thermal.c
> 
> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
> index b5b5fac..ed22a90 100644
> --- a/drivers/thermal/Kconfig
> +++ b/drivers/thermal/Kconfig
> @@ -192,6 +192,16 @@ config THERMAL_EMULATION
>  	  because userland can easily disable the thermal policy by simply
>  	  flooding this sysfs node with low temperature values.
>  
> +config HI3660_THERMAL
> +	tristate "Hi3660 thermal driver"
> +	depends on ARCH_HISI || COMPILE_TEST
> +	depends on HAS_IOMEM
> +	depends on OF
> +	default y
> +	help
> +	  Enable this to plug Hi3660 thermal driver into the Linux thermal
> +	  framework.
> +
>  config HISI_THERMAL
>  	tristate "Hisilicon thermal driver"
>  	depends on ARCH_HISI || COMPILE_TEST
> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
> index 094d703..f29d0a5 100644
> --- a/drivers/thermal/Makefile
> +++ b/drivers/thermal/Makefile
> @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL)	+= intel_pch_thermal.o
>  obj-$(CONFIG_ST_THERMAL)	+= st/
>  obj-$(CONFIG_QCOM_TSENS)	+= qcom/
>  obj-$(CONFIG_TEGRA_SOCTHERM)	+= tegra/
> +obj-$(CONFIG_HI3660_THERMAL)	+= hi3660_thermal.o
>  obj-$(CONFIG_HISI_THERMAL)     += hisi_thermal.o
>  obj-$(CONFIG_MTK_THERMAL)	+= mtk_thermal.o
>  obj-$(CONFIG_GENERIC_ADC_THERMAL)	+= thermal-generic-adc.o
> diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c
> new file mode 100644
> index 0000000..68fa9018
> --- /dev/null
> +++ b/drivers/thermal/hi3660_thermal.c
> @@ -0,0 +1,198 @@
> +/*
> + *  linux/drivers/thermal/hi3660_thermal.c
> + *
> + *  Copyright (c) 2017 Hisilicon Limited.
> + *  Copyright (c) 2017 Linaro Limited.
> + *
> + *  Author: Tao Wang <kevin.wangtao@hisilicon.com>
> + *  Author: Leo Yan <leo.yan@linaro.org>
> + *
> + *  This program is free software; you can redistribute it and/or modify
> + *  it under the terms of the GNU General Public License as published by
> + *  the Free Software Foundation; version 2 of the License.
> + *
> + *  This program is distributed in the hope that it will be useful,
> + *  but WITHOUT ANY WARRANTY; without even the implied warranty of
> + *  MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
> + *  GNU General Public License for more details.
> + *
> + *  You should have received a copy of the GNU General Public License
> + *  along with this program.  If not, see <http://www.gnu.org/licenses/>.
> + */
> +
> +#include <linux/clk.h>
> +#include <linux/device.h>
> +#include <linux/err.h>
> +#include <linux/io.h>
> +#include <linux/kernel.h>
> +#include <linux/of.h>
> +#include <linux/module.h>
> +#include <linux/platform_device.h>
> +#include <linux/thermal.h>
> +
> +#include "thermal_core.h"
> +
> +#define HW_MAX_SENSORS			4
> +#define HISI_MAX_SENSORS		6
> +#define SENSOR_MAX			4
> +#define SENSOR_AVG			5
> +
> +#define ADC_MIN		116
> +#define ADC_MAX		922
> +
> +/* hi3660 Thermal Sensor Dev Structure */
> +struct hi3660_thermal_sensor {
> +	struct hi3660_thermal_data *thermal;
> +	struct thermal_zone_device *tzd;
> +
> +	uint32_t id;
> +};
> +
> +struct hi3660_thermal_data {
> +	struct platform_device *pdev;
> +	struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS];
> +	void __iomem *thermal_base;
> +};
> +
> +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc };
> +
> +
> +static int hi3660_thermal_get_temp(void *_sensor, int *temp)
> +{
> +	struct hi3660_thermal_sensor *sensor = _sensor;
> +	struct hi3660_thermal_data *data = sensor->thermal;
> +	unsigned int idx;
> +	int val, average = 0, max = 0;
> +
> +	if (sensor->id < HW_MAX_SENSORS) {
> +		val = readl(data->thermal_base + sensor_reg_offset[sensor->id]);
> +		val = clamp_val(val, ADC_MIN, ADC_MAX);
> +	} else {
> +		for (idx = 0; idx < HW_MAX_SENSORS; idx++) {
> +			val = readl(data->thermal_base
> +					+ sensor_reg_offset[idx]);
> +			val = clamp_val(val, ADC_MIN, ADC_MAX);
> +			average += val;
> +			if (val > max)
> +				max = val;
> +		}
> +
> +		if (sensor->id == SENSOR_MAX)
> +			val = max;
> +		else if (sensor->id == SENSOR_AVG)
> +			val = average / HW_MAX_SENSORS;
> +	}
> +
> +	*temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000;

Where do these constants come from (165000 and 40000) can these some how
be rearranged and described in DT (coefficients) and using the offset and slope fields?

> +
> +	return 0;
> +}
> +
> +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = {
> +	.get_temp = hi3660_thermal_get_temp,
> +};
> +
> +static int hi3660_thermal_register_sensor(struct platform_device *pdev,
> +		struct hi3660_thermal_data *data,
> +		struct hi3660_thermal_sensor *sensor,
> +		int index)
> +{
> +	int ret = 0;
> +
> +	sensor->id = index;
> +	sensor->thermal = data;
> +
> +	sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev,
> +				sensor->id, sensor, &hi3660_of_thermal_ops);
> +	if (IS_ERR(sensor->tzd)) {
> +		ret = PTR_ERR(sensor->tzd);
> +		sensor->tzd = NULL;
> +	}
> +
> +	return ret;
> +}
> +
> +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor,
> +				       bool on)
> +{
> +	struct thermal_zone_device *tzd = sensor->tzd;
> +
> +	tzd->ops->set_mode(tzd,
> +		on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED);
> +}
> +
> +static int hi3660_thermal_probe(struct platform_device *pdev)
> +{
> +	struct device *dev = &pdev->dev;
> +	struct hi3660_thermal_data *data;
> +	struct resource *res;
> +	int ret = 0;
> +	int i;
> +
> +	data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL);
> +	if (!data)
> +		return -ENOMEM;
> +
> +	data->pdev = pdev;
> +	res = platform_get_resource(pdev, IORESOURCE_MEM, 0);
> +	data->thermal_base = devm_ioremap_resource(dev, res);
> +	if (IS_ERR(data->thermal_base)) {
> +		dev_err(dev, "failed get reg base\n");
> +		return -ENOMEM;
> +	}
> +
> +	platform_set_drvdata(pdev, data);
> +
> +	for (i = 0; i < HISI_MAX_SENSORS; ++i) {
> +		ret = hi3660_thermal_register_sensor(pdev, data,
> +						     &data->sensors[i], i);
> +		if (ret)
> +			dev_err(&pdev->dev,
> +				"failed to register thermal sensor%d: %d\n",
> +				i, ret);

Do you really want to continue if some of the sensors fail to register?

> +		else
> +			hi3660_thermal_toggle_sensor(&data->sensors[i], true);
> +	}
> +
> +	dev_info(&pdev->dev, "Thermal Sensor Loaded\n");

Do you really need the above info in the kernel log?

> +	return 0;
> +}
> +
> +static int hi3660_thermal_exit(struct platform_device *pdev)
> +{
> +	struct hi3660_thermal_data *data = platform_get_drvdata(pdev);
> +	int i;
> +
> +	for (i = 0; i < HISI_MAX_SENSORS; i++) {
> +		struct hi3660_thermal_sensor *sensor = &data->sensors[i];
> +
> +		if (!sensor->tzd)
> +			continue;

Why are you considering a valid case of not registering all expected
sensors?
> +
> +		hi3660_thermal_toggle_sensor(sensor, false);
> +	}
> +
> +	return 0;
> +}
> +
> +static const struct of_device_id hi3660_thermal_id_table[] = {
> +	{ .compatible = "hisilicon,hi3660-thermal" },
> +	{}
> +};
> +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table);
> +
> +static struct platform_driver hi3660_thermal_driver = {
> +	.probe = hi3660_thermal_probe,
> +	.remove = hi3660_thermal_exit,
> +	.driver = {
> +		.name = "hi3660_thermal",
> +		.of_match_table = hi3660_thermal_id_table,
> +	},
> +};
> +
> +module_platform_driver(hi3660_thermal_driver);
> +
> +MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>");
> +MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>");
> +MODULE_DESCRIPTION("hi3660 thermal driver");
> +MODULE_LICENSE("GPL v2");
> -- 
> 1.7.9.5
> 

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#1672284 — [Patch v2 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.

Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
---
Changes in v2:
- remove redundant property

 .../devicetree/bindings/thermal/hi3660-thermal.txt |   16 ++++++++++++++++
 1 file changed, 16 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt

diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
new file mode 100644
index 0000000..f3dddcf
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
@@ -0,0 +1,16 @@
+* Temperature Sensor on hisilicon hi3660 SoC
+
+** Required properties :
+
+- compatible: "hisilicon,thermal-hi3660".
+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+
+	tsensor: tsensor {
+		compatible = "hisilicon,thermal-hi3660";
+		reg = <0x0 0xfff30000 0x0 0x1000>;
+		#thermal-sensor-cells = <1>;
+	 };
-- 
1.7.9.5

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#1672285 — [Patch v2 3/3] arm64: dts: register Hi3660's thermal sensor

Bind thermal sensor driver for Hi3660.

Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
Signed-off-by: Leo Yan <leo.yan@linaro.org>
---
Changes in v2:
- rebase changes on linux next

 arch/arm64/boot/dts/hisilicon/hi3660.dtsi |    6 ++++++
 1 file changed, 6 insertions(+)

diff --git a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
index c6a1961..a6a1e01 100644
--- a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
+++ b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
@@ -848,5 +848,11 @@
 				     &sdio_cfg_func>;
 			status = "disabled";
 		};
+
+		tsensor: tsensor {
+			compatible = "hisilicon,hi3660-thermal";
+			reg = <0x0 0xfff30000 0x0 0x1000>;
+			#thermal-sensor-cells = <1>;
+		};
 	};
 };
-- 
1.7.9.5

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#1679254 — Re: [Patch v2 3/3] arm64: dts: register Hi3660's thermal sensor

On Thu, Jun 22, 2017 at 11:42:03AM +0800, Tao Wang wrote:
> Bind thermal sensor driver for Hi3660.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> Signed-off-by: Leo Yan <leo.yan@linaro.org>
> ---
> Changes in v2:
> - rebase changes on linux next
> 
>  arch/arm64/boot/dts/hisilicon/hi3660.dtsi |    6 ++++++
>  1 file changed, 6 insertions(+)
> 
> diff --git a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
> index c6a1961..a6a1e01 100644
> --- a/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
> +++ b/arch/arm64/boot/dts/hisilicon/hi3660.dtsi
> @@ -848,5 +848,11 @@
>  				     &sdio_cfg_func>;
>  			status = "disabled";
>  		};
> +
> +		tsensor: tsensor {
> +			compatible = "hisilicon,hi3660-thermal";
> +			reg = <0x0 0xfff30000 0x0 0x1000>;
> +			#thermal-sensor-cells = <1>;
> +		};

Are you planning to also add thermal zone entries?

>  	};
>  };
> -- 
> 1.7.9.5
> 

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#1679255 — Re: [Patch v2 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

On Thu, Jun 22, 2017 at 11:42:01AM +0800, Tao Wang wrote:
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi3660 SoC.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> ---
> Changes in v2:
> - remove redundant property
> 
>  .../devicetree/bindings/thermal/hi3660-thermal.txt |   16 ++++++++++++++++
>  1 file changed, 16 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> 
> diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> new file mode 100644
> index 0000000..f3dddcf
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> @@ -0,0 +1,16 @@
> +* Temperature Sensor on hisilicon hi3660 SoC
> +

Would you mind add some more description of the sensors/where to find
further hardware documentation?

> +** Required properties :
> +
> +- compatible: "hisilicon,thermal-hi3660".
> +- reg: physical base address of thermal sensor and length of memory mapped
> +  region.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +Example :
> +
> +	tsensor: tsensor {
> +		compatible = "hisilicon,thermal-hi3660";
> +		reg = <0x0 0xfff30000 0x0 0x1000>;
> +		#thermal-sensor-cells = <1>;
> +	 };
> -- 
> 1.7.9.5
> 

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#1670644 — Re: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

Hi Tao,

On 2017/6/20 4:40, Tao Wang wrote:
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi3660 SoC.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> ---
>  .../devicetree/bindings/thermal/hi3660-thermal.txt |   17 +++++++++++++++++
>  1 file changed, 17 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> 
> diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> new file mode 100644
> index 0000000..c034670
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> @@ -0,0 +1,17 @@
> +* Temperature Sensor on hisilicon hi3660 SoC
> +
> +** Required properties :
> +
> +- compatible: "hisilicon,thermal-hi3660".

It is better to put the SoC name before the function string.

BR,
Wei

> +- reg: physical base address of thermal sensor and length of memory mapped
> +  region.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +Example :
> +
> +	tsensor: tsensor {
> +		compatible = "hisilicon,thermal-hi3660";
> +		reg = <0x0 0xfff30000 0x0 0x1000>;
> +		#thermal-sensor-cells = <1>;
> +		status = "ok";
> +	 };
> 

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#1671289 — Re: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

e( 2017/6/20 18:27, Wei Xu ei
:
> Hi Tao,
> 
> On 2017/6/20 4:40, Tao Wang wrote:
>> This adds documentation of device tree bindings for the
>> thermal sensor controller of hi3660 SoC.
>>
>> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
>> ---
>>   .../devicetree/bindings/thermal/hi3660-thermal.txt |   17 +++++++++++++++++
>>   1 file changed, 17 insertions(+)
>>   create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
>>
>> diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
>> new file mode 100644
>> index 0000000..c034670
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
>> @@ -0,0 +1,17 @@
>> +* Temperature Sensor on hisilicon hi3660 SoC
>> +
>> +** Required properties :
>> +
>> +- compatible: "hisilicon,thermal-hi3660".
> 
> It is better to put the SoC name before the function string.
ok, I will fix it, thank you.
> 
> BR,
> Wei
> 
>> +- reg: physical base address of thermal sensor and length of memory mapped
>> +  region.
>> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
>> +
>> +Example :
>> +
>> +	tsensor: tsensor {
>> +		compatible = "hisilicon,thermal-hi3660";
>> +		reg = <0x0 0xfff30000 0x0 0x1000>;
>> +		#thermal-sensor-cells = <1>;
>> +		status = "ok";
>> +	 };
>>
> 
> 
> .
> 

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