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Groups > linux.kernel > #1260742 > unrolled thread
| Started by | Punit Agrawal <punit.agrawal@arm.com> |
|---|---|
| First post | 2015-11-02 17:00 +0100 |
| Last post | 2015-11-04 20:40 +0100 |
| Articles | 3 — 3 participants |
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Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model Punit Agrawal <punit.agrawal@arm.com> - 2015-11-02 17:00 +0100
Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model Viresh Kumar <viresh.kumar@linaro.org> - 2015-11-02 17:20 +0100
Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model Eduardo Valentin <edubezval@gmail.com> - 2015-11-04 20:40 +0100
| From | Punit Agrawal <punit.agrawal@arm.com> |
|---|---|
| Date | 2015-11-02 17:00 +0100 |
| Subject | Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model |
| Message-ID | <qqpGx-77v-1@gated-at.bofh.it> |
Viresh Kumar <viresh.kumar@linaro.org> writes: > On 22-10-15, 20:02, Dawei Chien wrote: >> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone. >> The power allocator governor allocates power budget to control CPU temperature. >> >> Power Allocator governor is able to keep SOC temperature within a >> defined temperature range to avoid SOC overheat and keep it's >> performance. mt8173-cpufreq.c need to register its' own power model >> with power allocator thermal governor, so that power allocator >> governor can allocates suitable power budget to control CPU >> temperature. >> >> PATCH1 is base on >> https://patchwork.kernel.org/patch/7034601/ >> >> PATCH2 is base on Sascha's thermal driver V9 >> https://patchwork.kernel.org/patch/7249821/ >> https://patchwork.kernel.org/patch/7249861/ >> https://patchwork.kernel.org/patch/7249891/ >> >> Change since V1: >> include mt8171.h and sort header file for mt8173.dtsi >> >> Change since V2: >> Move dynamic/static power model in device tree >> >> Dawei.Chien (2): >> thermal: mediatek: Add cpu power cooling model. >> arm64: dts: mt8173: Add thermal zone node for mt8173. > > Sorry for being extremely late in reviewing this stuff. You are > already on v3 and I haven't reviewed it once. Mostly due to bad timing > of my holidays and other work pressure. > > Now, there are few things that I feel are not properly addressed here, > and I may be wrong: > - Where are the bindings for static-power-points and > dynamic-power-coefficient. Sorry I failed to see them in this or > other series you mentioned. For dynamic power, I had posted some patches[0][1][2] introducing the binding as well as updating cooling device registration via cpufreq driver. Now that the SCPI hwmon driver is merged, I should re-send the remaining patches. [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html > - Even then, why should we be adding another table into DT for > voltage/power ? And not reuse and extend the opp-v2 stuff which is > already mainlined now. > - There are few issues with the code as well, but I want to see where > the bindings should go first. And then only discuss the code > further. -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
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| From | Viresh Kumar <viresh.kumar@linaro.org> |
|---|---|
| Date | 2015-11-02 17:20 +0100 |
| Message-ID | <qqpZU-7ux-3@gated-at.bofh.it> |
| In reply to | #1260742 |
On 02-11-15, 15:53, Punit Agrawal wrote: > For dynamic power, I had posted some patches[0][1][2] introducing the > binding as well as updating cooling device registration via cpufreq > driver. Now that the SCPI hwmon driver is merged, I should re-send the > remaining patches. > > [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html > [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html > [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html Sure. Just that whatever can be merged with opp-v2 should be merged. -- viresh -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
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| From | Eduardo Valentin <edubezval@gmail.com> |
|---|---|
| Date | 2015-11-04 20:40 +0100 |
| Message-ID | <qrc4y-4EN-19@gated-at.bofh.it> |
| In reply to | #1260742 |
On Mon, Nov 02, 2015 at 03:53:33PM +0000, Punit Agrawal wrote: > Viresh Kumar <viresh.kumar@linaro.org> writes: > > > On 22-10-15, 20:02, Dawei Chien wrote: > >> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone. > >> The power allocator governor allocates power budget to control CPU temperature. > >> > >> Power Allocator governor is able to keep SOC temperature within a > >> defined temperature range to avoid SOC overheat and keep it's > >> performance. mt8173-cpufreq.c need to register its' own power model > >> with power allocator thermal governor, so that power allocator > >> governor can allocates suitable power budget to control CPU > >> temperature. > >> > >> PATCH1 is base on > >> https://patchwork.kernel.org/patch/7034601/ > >> > >> PATCH2 is base on Sascha's thermal driver V9 > >> https://patchwork.kernel.org/patch/7249821/ > >> https://patchwork.kernel.org/patch/7249861/ > >> https://patchwork.kernel.org/patch/7249891/ > >> > >> Change since V1: > >> include mt8171.h and sort header file for mt8173.dtsi > >> > >> Change since V2: > >> Move dynamic/static power model in device tree > >> > >> Dawei.Chien (2): > >> thermal: mediatek: Add cpu power cooling model. > >> arm64: dts: mt8173: Add thermal zone node for mt8173. > > > > Sorry for being extremely late in reviewing this stuff. You are > > already on v3 and I haven't reviewed it once. Mostly due to bad timing > > of my holidays and other work pressure. > > > > Now, there are few things that I feel are not properly addressed here, > > and I may be wrong: > > - Where are the bindings for static-power-points and > > dynamic-power-coefficient. Sorry I failed to see them in this or > > other series you mentioned. > > For dynamic power, I had posted some patches[0][1][2] introducing the > binding as well as updating cooling device registration via cpufreq > driver. Now that the SCPI hwmon driver is merged, I should re-send the > remaining patches. > > [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html Are you sure this binding is applicable only to ARM cpus? > [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html > [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html > > > - Even then, why should we be adding another table into DT for > > voltage/power ? And not reuse and extend the opp-v2 stuff which is > > already mainlined now. > > - There are few issues with the code as well, but I want to see where > > the bindings should go first. And then only discuss the code > > further. > -- > To unsubscribe from this list: send the line "unsubscribe linux-pm" in > the body of a message to majordomo@vger.kernel.org > More majordomo info at http://vger.kernel.org/majordomo-info.html -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
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