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Groups > linux.kernel > #1557465
| From | Javier Martinez Canillas <javier@osg.samsung.com> |
|---|---|
| Newsgroups | linux.kernel |
| Subject | [PATCH] usb: dwc3: exynos: Remove MODULE_ALIAS() |
| Date | 2017-01-12 15:00 +0100 |
| Message-ID | <sYO53-4DI-3@gated-at.bofh.it> (permalink) |
| Organization | linux.* mail to news gateway |
Exynos is DT-only, so there's no need for a platform MODALIAS.
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
---
drivers/usb/dwc3/dwc3-exynos.c | 1 -
1 file changed, 1 deletion(-)
diff --git a/drivers/usb/dwc3/dwc3-exynos.c b/drivers/usb/dwc3/dwc3-exynos.c
index e27899bb5706..2e555a69c8ab 100644
--- a/drivers/usb/dwc3/dwc3-exynos.c
+++ b/drivers/usb/dwc3/dwc3-exynos.c
@@ -288,7 +288,6 @@ static struct platform_driver dwc3_exynos_driver = {
module_platform_driver(dwc3_exynos_driver);
-MODULE_ALIAS("platform:exynos-dwc3");
MODULE_AUTHOR("Anton Tikhomirov <av.tikhomirov@samsung.com>");
MODULE_LICENSE("GPL v2");
MODULE_DESCRIPTION("DesignWare USB3 EXYNOS Glue Layer");
--
2.7.4
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[PATCH] usb: dwc3: exynos: Remove MODULE_ALIAS() Javier Martinez Canillas <javier@osg.samsung.com> - 2017-01-12 15:00 +0100
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