RE: [PATCH V2 03/10] Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding

From	Steve Twiss <stwiss.opensource@diasemi.com>
Newsgroups	linux.kernel
Subject	RE: [PATCH V2 03/10] Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
Date	2016-11-29 12:20 +0100
Message-ID	<sIOC6-7Kl-29@gated-at.bofh.it> (permalink)
References	<swAbv-6Tj-3@gated-at.bofh.it> <swAbw-6Tj-35@gated-at.bofh.it> <sIEW5-Wo-11@gated-at.bofh.it>
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Hi Eduardo,

On 29 November 2016 00:59, Eduardo Valentin, wrote:
> On Wed, Oct 26, 2016 at 05:56:37PM +0100, Steve Twiss wrote:
> > +Optional properties:
> > +
> > +- dlg,tjunc-temp-polling-period-ms : Specify the polling period, measured
> > +    in milliseconds, between thermal zone device update checks.
> 
> Can you please elaborate on why you need this chip manufacture specific
> property?
> 
> Can we use the polling property of already existing in the
> Documentation/devicetree/bindings/thermal/thermal.txt
> 
> See the polling properties.

[...]
> > +			dlg,tjunc-temp-polling-period-ms = <3000>;

Agreed. There is a polling period built into the thermal core. I've discussed my
reasoning for this decision in answer to your other e-mail. Please refer to the
other discussion thread: https://lkml.org/lkml/2016/11/29/262

Regards,
Steve

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Re: [PATCH V2 03/10] Documentation: devicetree: thermal: da9062/61  TJUNC temperature binding Eduardo Valentin <edubezval@gmail.com> - 2016-11-29 02:00 +0100
  RE: [PATCH V2 03/10] Documentation: devicetree: thermal: da9062/61  TJUNC temperature binding Steve Twiss <stwiss.opensource@diasemi.com> - 2016-11-29 12:20 +0100

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