Regard of thermal power allocator's coefficients

From	Leo Yan <leo.yan@linaro.org>
Newsgroups	linux.kernel
Subject	Regard of thermal power allocator's coefficients
Date	2016-02-14 12:10 +0100
Message-ID	<r22IW-1QV-19@gated-at.bofh.it> (permalink)
Organization	linux.* mail to news gateway

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Hi there,

I'm trying to upstreaming IPA patches for 96board Hikey, but so far
there have no standard DT binding for passing IPA coefficients for
power modeling.

So want to firstly to confirm if should we pass coefficients by using
device tree? Is someone working on related work for this?

Here has another more straightforward method is to directly to
include power model's coefficients in thermal sensor driver (such like
drivers/thermal/hisi_thermal.c), but my concern is this method will
include SoC specific data in the common thermal sensor driver,
so is this doable?

Welcome any suggestion.

Thanks,
Leo Yan

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Regard of thermal power allocator's coefficients Leo Yan <leo.yan@linaro.org> - 2016-02-14 12:10 +0100
  Re: Regard of thermal power allocator's coefficients Eduardo Valentin <edubezval@gmail.com> - 2016-02-14 18:20 +0100
    Re: Regard of thermal power allocator's coefficients Leo Yan <leo.yan@linaro.org> - 2016-02-15 05:50 +0100
      Re: Regard of thermal power allocator's coefficients Javi Merino <javi.merino@arm.com> - 2016-02-18 16:20 +0100
        Re: Regard of thermal power allocator's coefficients Leo Yan <leo.yan@linaro.org> - 2016-02-19 10:10 +0100

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