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Moore's Years: 3D chip stacking will take Moore's Law past 2020

From	computer45 <computer45@cyber.com>
Newsgroups	comp.programming.threads
Subject	Moore's Years: 3D chip stacking will take Moore's Law past 2020
Date	2018-03-25 20:58 -0400
Organization	A noiseless patient Spider
Message-ID	<p99gjn$3ot$11@dont-email.me> (permalink)

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Hello,

Read this:


Moore's Years: 3D chip stacking will take Moore's Law past 2020


"Similar to Aquasar, the team plans to design microchannels with 
single-phase liquid and two-phase cooling systems using nano-surfaces 
that pipe coolants—including water and environmentally-friendly 
refrigerants—within a few millimeters of the chip to absorb the heat, 
like a sponge, and draw it away. Once the liquid leaves the circuit in 
the form of steam, a condenser returns it to a liquid state, where it is 
then pumped back into the processor, thus completing the cycle.

As we will demonstrate with ETH in the Aquasar project, employing 
microchannels carrying liquid coolants offers a significant advantage in 
addressing heat-removal challenges, and this should lead to practical 3D 
systems," said Bruno Michel, manager advanced thermal packaging, IBM 
Research - Zurich."


Read more here:

https://phys.org/news/2010-03-years-3d-chip-stacking-law.html




Thank you,
Amine Moulay Ramdane.

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Moore's Years: 3D chip stacking will take Moore's Law past 2020 computer45 <computer45@cyber.com> - 2018-03-25 20:58 -0400

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