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| From | Paul E Bennett <Paul_E.Bennett@topmail.co.uk> |
| Newsgroups | comp.lang.forth |
| Subject | Re: Question to Albert |
| Date | Thu, 18 Sep 2014 08:08:41 +0100 |
| Organization | Hidecs Consultancy |
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rickman wrote: > I reading a bit of the blog by Yossi Kreinin and found the following > comment by Albert van der Horst... > > http://yosefk.com/blog/my-history-with-forth-stack-machines.html#comment-2536 > > "And the pinout! Only hobbyist would try those chips out. There are no > pins,, just solderareas, with a stride of .4 mm (not mils, 400 > micrometer). Hobbyist trying those out would be probably my age (over > sixty)." > > The context is the GA144. I have to agree with most of what he said, > but I don't understand the portion quoted above. I assume he is > complaining about the package rather than the pin out. In reality I > think the package was one of the best choices they could have made. In > the real world size is a *huge* factor for ICs these days and this was a > great tradeoff between size and usability. > > While many devices are shipped in BGA sorts of packages (FPGAs and many > CPUS) this device is in a no lead quad flat pack. No, this is not so > great for prototyping by hand, but prototyping by hand is virtually gone > in the professional world. Nearly every project uses a PCB on the first > revision of the board and plan for two or even three spins of the board > total. > > I like the package because the dimensions are compatible with relaxed > 6/6 mil trace and space design rules. This allows a lower board cost. > Heck, I can get protos from oshpark.com for $10 a square inch with 5/5 > design rules. (a great deal btw, 3 boards, 2 weeks @ $10/sq inch) > > I hope I understand what Albert meant and am not just ranting about > nothing. Like Albert, I am also over 60. However, I do not see what the problem is with the GA144 even for hand soldered prototype. It probably takes a properly laid out PCB as your basis but the soldering in task is quite easy to accomplish. My most recent experience with this was on a tiny IC package (20 pins) with similarly close pin-spacing. The technique is to flood solder across all pins then use solder-wick to pull the excess away. I find a decent angle-poise magnifier is handy when doing this sort of thing and access to a microscope for final inspections. -- ******************************************************************** Paul E. Bennett IEng MIET.....<email://Paul_E.Bennett@topmail.co.uk> Forth based HIDECS Consultancy.............<http://www.hidecs.co.uk> Mob: +44 (0)7811-639972 Tel: +44 (0)1235-510979 Going Forth Safely ..... EBA. www.electric-boat-association.org.uk.. ********************************************************************
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Question to Albert rickman <gnuarm@gmail.com> - 2014-09-17 20:27 -0400
Re: Question to Albert Paul E Bennett <Paul_E.Bennett@topmail.co.uk> - 2014-09-18 08:08 +0100
Re: Question to Albert rickman <gnuarm@gmail.com> - 2014-09-18 03:55 -0400
Re: Question to Albert albert@spenarnc.xs4all.nl (Albert van der Horst) - 2014-09-18 10:37 +0000
Re: Question to Albert rickman <gnuarm@gmail.com> - 2014-09-18 16:30 -0400
Re: Question to Albert Paul E Bennett <Paul_E.Bennett@topmail.co.uk> - 2014-09-19 01:11 +0100
Re: Question to Albert Brad Eckert <hwfwguy@gmail.com> - 2014-09-27 17:10 -0700
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