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Groups > sci.electronics.components > #6623
| From | john larkin <jl@glen--canyon.com> |
|---|---|
| Newsgroups | sci.electronics.design, sci.electronics.components |
| Subject | Re: IC aging |
| Date | 2025-12-01 10:26 -0800 |
| Organization | Highland Technology |
| Message-ID | <esmrikhm3g188f3oc49tscokf8hhhhh9dq@4ax.com> (permalink) |
| References | <10gis48$328$1@reader2.panix.com> |
Cross-posted to 2 groups.
On Mon, 1 Dec 2025 01:47:52 -0000 (UTC), David Lesher <wb8foz@panix.com> wrote: >I'm curious about lifetime of IC's from the 1980's. > >Has there been any published work on degradation >of stored IC's of that era? There are some issues, like oxidation, corrosion and tin whisker growth. Best to keep them cool and dry. Powered up, some older parts had electromigration problems, from excess current density in metalization. And the dreaded Purple Plague. Really early plastic ICs had creepy-crawley epoxy that broke things. Some parts had slow ion migration in oxide layers too. There's a lot of stuff online: https://www.ti.com/lit/pdf/slva304/ John Larkin Highland Tech Glen Canyon Design Center Lunatic Fringe Electronics
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IC aging David Lesher <wb8foz@panix.com> - 2025-12-01 01:47 +0000 Re: IC aging Bill Sloman <bill.sloman@ieee.org> - 2025-12-01 14:33 +1100 Re: IC aging john larkin <jl@glen--canyon.com> - 2025-12-01 10:26 -0800 Re: IC aging Joerg <news@analogconsultants.com> - 2025-12-01 10:38 -0800
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