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Groups > comp.lang.forth > #13500
| From | "Rod Pemberton" <do_not_have@notemailnot.cmm> |
|---|---|
| Newsgroups | comp.lang.forth |
| Subject | Re: Phase Change Memory |
| Date | 2012-07-04 05:05 -0400 |
| Organization | Aioe.org NNTP Server |
| Message-ID | <jt10t2$1mm$1@speranza.aioe.org> (permalink) |
| References | <5b646961-1ba6-44c4-b51a-cd04b923a05e@googlegroups.com><jstbnl$ko7$1@speranza.aioe.org><e9172df6-0cbf-4a77-90e2-89d0656b52a4@q2g2000vbv.googlegroups.com> <7x7gukn3cq.fsf@ruckus.brouhaha.com> |
"Paul Rubin" <no.email@nospam.invalid> wrote in message news:7x7gukn3cq.fsf@ruckus.brouhaha.com... > [...] PCM [...] > > I do worry about data retention at high temperatures. Which high temperatures: operating or manufacturing? Bernd said it's a BGA package... Heat is especially bad for BGAs - which will unsolder themselves. The chip heats up, expands or twists, applies a stress/strain, excessive heat unsolders a "pin", it moves, disconnects from circuit... BGAs becoming unsoldered is the reason your XBOX 360 or ultra-expensive high-end video card dies. I'm not sure what the soldering temperatures are for surface mount or BGAs. I'd assume they're somewhat less, maybe substantially less, than through-hole since the solder doesn't have to wick into holes. A wave soldering machine is what solders through-hole circuits. For a wave soldering machine (AIR - this was some 15 to 20 years ago), the air temperatures were 700 to 800 degrees Fahrenheit (371 to 426 degrees Celsius), and the molten solder was 450 degF (232 degC). *Everything* on the board was hot enough to burn you badly. Shields were constructed to prevent plastics from melting. Those temperatures were high since they chose to switch to a bio-degradable water-based flux, instead of a solvent based flux. I.e., they had to drive off quite a bit of water to leave flux on the board. The water had to be removed before entering the "fountain" of molten solder, or the solder would splatter leaving lead balls all over the circuit board... > The blurb says that the heat of soldering a chip to a circuit board erases > the data. That seems to indicate the phase change material has a "low" temperature for it's phase change, at least relative to production soldering temperatures. > I'd like to think heating the pins doesn't cause the actual chip die to > get all that hot. During manufacturing? They had IC packages where the casings separated from heat from soldering. I.e., the top case separated from the bottom case and exposed the die to air (died upon power-up). That was most likely due to the higher temperatures used in that company's process and some cheap ICs. More expensive ICs of the same type didn't fail that way. Or, by hand soldering? If a hobbyist is soldering the chip, the temperature of the soldering iron is much lower. However, they can still overheat it and cause it to fail. This happens if they solder too many pins too quickly causing heat to buildup. Do one or two. Let cool. Repeat. > So I worry about high ambient temperatures erasing > the data. Once it's through manufacturing, if it's still operating and wasn't heat damaged, it'll be operating at much "lower" temperatures from then onwards. But, if the PCM temp is too low, or you have old heat sink grease or insufficient heat sinking, I could see data loss as a real possibility. If the PCM memory is enclosed, I could see heat build up as being an issue too. Repeated heating cycles can cause cracking or stress or strain related failures too. Do you remember how hot the first CD-burners made CDs by the time they were done burning? Sometimes, you couldn't access them later because they shrunk so much when cooled. This PC is the first one, of dozens, where I haven't had to change the thermal grease for the processor after a few years because of heat failure of the grease. Rod Pemberton
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Phase Change Memory Jason Damisch <jasondamisch@yahoo.com> - 2012-07-02 08:39 -0700
Re: Phase Change Memory "Rod Pemberton" <do_not_have@notemailnot.cmm> - 2012-07-02 19:45 -0400
Re: Phase Change Memory Mark Wills <markrobertwills@yahoo.co.uk> - 2012-07-03 03:29 -0700
Re: Phase Change Memory Paul Rubin <no.email@nospam.invalid> - 2012-07-03 10:47 -0700
Re: Phase Change Memory Bernd Paysan <bernd.paysan@gmx.de> - 2012-07-04 00:38 +0200
Re: Phase Change Memory Albert van der Horst <albert@spenarnc.xs4all.nl> - 2012-07-04 02:06 +0000
Re: Phase Change Memory Paul Rubin <no.email@nospam.invalid> - 2012-07-04 10:04 -0700
Re: Phase Change Memory "Rod Pemberton" <do_not_have@notemailnot.cmm> - 2012-07-04 05:05 -0400
Re: Phase Change Memory rickman <gnuarm@gmail.com> - 2012-07-04 12:33 -0700
Re: Phase Change Memory "Rod Pemberton" <do_not_have@notemailnot.cmm> - 2012-07-04 21:48 -0400
Re: Phase Change Memory rickman <gnuarm@gmail.com> - 2012-07-05 09:57 -0700
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