Path: csiph.com!weretis.net!feeder8.news.weretis.net!reader5.news.weretis.net!news.solani.org!.POSTED!not-for-mail From: Mild Shock Newsgroups: sci.math,sci.physics.relativity Subject: 3D RAM the new normal for SSDs [Mac Neo Case Study] (Was: Economy of Maturation: Mobile HBM Coming!) Date: Wed, 22 Jul 2026 14:01:26 +0200 Message-ID: <113qbem$7ahs$1@solani.org> References: <1131t35$tqe$3@solani.org> <113q9gn$7t3k$1@solani.org> MIME-Version: 1.0 Content-Type: text/plain; charset=UTF-8; format=flowed Content-Transfer-Encoding: 8bit Injection-Date: Wed, 22 Jul 2026 12:01:26 -0000 (UTC) Injection-Info: solani.org; logging-data="240188"; mail-complaints-to="abuse@news.solani.org" User-Agent: Mozilla/5.0 (Windows NT 10.0; Win64; x64; rv:140.0) Gecko/20100101 Firefox/140.0 SeaMonkey/2.53.24 Cancel-Lock: sha1:V6iq1pmKpHAfhJCOjO+IVEiCZwc= X-User-ID: eJwFwYEBwCAIA7CXlEKH50iR/09YEuCmPmfQY2JuZuzyfvqaJqrsrWPqNqRPOGpbc3mjLhp5KK3RO477DD9itxXm In-Reply-To: <113q9gn$7t3k$1@solani.org> Xref: csiph.com sci.math:646908 sci.physics.relativity:671555 Hi, 3D RAM is already the new normal for SSDs. Nearly all mainstream modern SSDs use 3D NAND (or V-NAND), where billions of memory cells are stacked vertically in skyscrapers rather than being laid out flat. The Story Behind V-NAND Memory Solution https://news.samsung.com/us/story-behind-samsungs-pioneering-v-nand-memory-solution Unlike a traditional desktop or some Windows laptops where you can slide an NVMe M.2 drive into a slot, the MacBook Neo has its 3D NAND chips permanently soldered directly onto the laptop's motherboard. There is no card or physical drive to pull out. Instead of using a third-party SSD controller chip (like Phison or Silicon Motion), the storage logic is integrated directly into the Apple A18 Pro processor. The processor communicates with the soldered NAND storage via a custom internal NVMe protocol over a PCIe connection. amsung's roadmap is truly ambitious, with plans to launch the 11th generation of NAND in 2027 with an estimated 50% improvement in I/O rates, followed by 1,000-layer NAND chips by 2030. Its competitor, SK hynix, is also working on 400-layer NAND aiming to have the technology ready for mass production by the end of 2025, as we previously mentioned in August. https://www.techpowerup.com/328244/samsung-plans-400-layer-v-nand-for-2026-and-dram-technology-advancements-by-2027 Bye Mild Shock schrieb: > Hi, > > "Mobile HBM" refers to a new, under-development > form of High Bandwidth Memory (HBM) optimized > specifically for energy-efficient mobile devices > like smartphones. Manufacturers such as Samsung > and SK Hynix are developing this technology to > make the massive data bandwidth required for complex, > on-device AI applications available within the strict > power and space constraints of mobile phones. > > Unlike classic HBM solutions, which rely on > extra-wide silicon interposers for massive data > throughput in data centers and graphics cards, > Mobile HBM utilizes stacked LPDDR architectures. > The goal is to drastically reduce power consumption > and heat generation so that large AI models can > run directly on the device (on-device) without > placing too heavy a load on the battery. The > technology is expected to hit the market starting > in 2026/2027, with Apple among those showing great > interest in integrating it into future iPhone generations." > > https://www.remio.ai/post/mobile-hbm-the-ai-memory-tech-that-could-reshape-the-iphone > > > Just think of a Mac Neo, which has now 8 GB, > but the memory going 3D in 12 layers, thats a > massive of 96 GB very fast memory. > > Economy of scale comes later, when the same CPU/ > GPU/RAM combo is used for phones, tablets, desktop, > or with other humidity and temperature parameters > > for cars, robots, drones, etc... > > Bye > > Mild Shock schrieb: >> Hi, >> >> For marketing purposes people >> typically look at the race towards >> 2nm, and we find: >> >> A month ago, Apple lost its exclusivity >> on 3 nm smartphone processors with >> MediaTek’s Dimensity 9400 chip, integrated >> in the Vivo X200 Pro smartphone. Qualcomm >> is also in the race with its recently >> unveiled Snapdragon 8 Elite and set to >> power the Xiaomi 15 Pro in 2025. However, >> Apple should regain its position as innovation >> leader in 2026 with the release of the >> iPhone 18, which should feature the A20 >> chip built on TSMC’s 2 nm process." >> >> But there is a vertical vias revolution >> going on as well, some SOCs typically >> being at 18 layers now: >> >> Zooming Into a CPU (It's Incredible) >> https://www.youtube.com/watch?v=Bez-2cvYja0 >> >> imec has coined the term CMOS 2.0: >> >> LEUVEN (Belgium), MARCH 12th, 2026 — Imec, >> a world-leading research and innovation hub >> in advanced semiconductor technologies, has >> launched a first-of-its-kind consortium with >> 26 European university groups that will jointly >> work on the technology roadmap beyond >> CMOS scaling (CMOS 2.0). >> https://www.imec-int.com/en/press/imec-launches-university-consortium-around-next-generation-chips >> >> >> So we might see more mobile grade GPUs. >> >> Bye >