Path: csiph.com!fu-berlin.de!uni-berlin.de!individual.net!not-for-mail From: rbowman Newsgroups: comp.os.linux.misc Subject: Re: IBM - New SUB-Nanometer STACKED Chip Date: 7 Jul 2026 04:14:54 GMT Lines: 16 Message-ID: References: <112hkad$2h4su$2@dont-email.me> Mime-Version: 1.0 Content-Type: text/plain; charset=UTF-8 Content-Transfer-Encoding: 8bit X-Trace: individual.net fnwBICMe0CsW5gOf8TL0kQDANJ2JmClUI/1hXPN6+Kgiescq6/ Cancel-Lock: sha1:ZTRM8LYOFjGaGOKIfIxkzlaNT3k= sha256:GWAN6GW+Bi3/YqF4vV67/BohuY0+5M53HAiiUobLtrk= User-Agent: Pan/0.165 (Kostiantynivka) Xref: csiph.com comp.os.linux.misc:88743 On Tue, 7 Jul 2026 01:21:18 -0000 (UTC), Lawrence D’Oliveiro wrote: > On Sun, 28 Jun 2026 18:09:44 GMT, Charlie Gibbs wrote: > >> Dunno - but I do remember that manufacturers hit a wall for a while >> when trying to get below 1 micrometer. > > Part of the way past the barrier was, shall we say, redefining the > problem. Photolithography was one limit. State of the art now is extreme untraviolet lithography with a 13.5 nm wavelength. ASML in the Netherlands is the sole source although you can bet the Chinese are working overtime. Next stop is x-rays. It has been done on an experimental basis but is even more costly.